2025.04.21

2025.04.22

2025.04.23

2025.04.24

2025.04.21

1:30 PM

Tutorial 1 - Advancement on Device Simulation, Modeling and Reliability

1:30 PM - 4:50 PM | Ballroom A

Invited Speakers：
● Kuo-Hsing Kao, National Cheng Kung University
● Yi-Hung Tsai, TSMC
● Pei-Jean Liao, TSMC

Tutorial 2 - Advanced Interconnect and Packaging Technologies

1:30 PM - 4:50 PM | Ballroom B

Invited Speakers：
● Subramanian S. Iyer, University of California, Los Angeles
● Kangwook Lee, SK HYNIX INC.
● Dyi-Chung Hu, SiPlus CO., LTD.

Tutorial 3 - Emerging Technologies for Automotive Electronics

1:30 PM - 6:15 PM | Ballroom C

Invited Speakers：
● Jui-Cheng Huang, TSMC
● Shang-Li Chen, Himax Technologies, Inc.
● Ching-Lung Su, National Yunlin University of Science and Technology

2025.04.22

9:00 AM

Opening - Opening & Award Ceremony

9:00 AM - 10:10 AM | Ballroom A+B

10:30 AM

J1 - Plenary Session

10:30 AM - 12:10 PM | Ballroom A+B

Invited Speakers：
● Suman Datta, Georgia Institute of Technology
● Makoto Ikeda, The University of Tokyo

12:50 PM

T1 - Poster Session

12:50 PM - 5:30 PM | Ballroom D

1:40 PM

T2 - CMOS Memory and Cryo CMOS

1:40 PM - 3:00 PM | Ballroom A

J2 - Silicon Photonics and Optical Communication

1:40 PM - 5:00 PM | Ballroom B

Invited Speakers：
● Shinji Matsuo, NTT Corporation
● Rachid TAIBI, SOITEC
● S. J. Ben Yoo, University of California, Davis
● C. Patrick Yue, The Hong Kong University of Science and Technolo (HKUST)
● Pen-Jui Peng, National Tsing Hua University
● Samuel Palermo, Texas A&M University

D1 - High-Speed Analog and RF

1:40 PM - 3:00 PM | Ballroom C

D2 - AI Hardware Accelerator

1:40 PM - 3:00 PM | Mezzanine A+B

3:20 PM

T3 - High Performance, Ultralow Power CMOS Materials and Devices

3:20 PM - 5:20 PM | Ballroom A

Invited Speakers：
● Gong Xiao, National University of Singapore
● Chee Wee Liu, National Taiwan University
● Eric Pop, Stanford University
● Souvik Ghosh, imec

3:30 PM

D3 - ADC and Power Management

3:30 PM - 4:50 PM | Ballroom C

D4 - Efficient Signal Processing Circuit Design

3:30 PM - 4:50 PM | Mezzanine A+B

2025.04.23

8:30 AM

J3 - Plenary Session

8:30 AM - 10:10 AM | Ballroom B

Invited Speakers：
● Ken Rim, Samsung Electronics Co., Ltd.
● Ken Chang, Marvell Technology, Inc.

10:20 AM

T4 - Modeling of Leading Edge Node of CMOS

10:20 AM - 11:40 AM | Ballroom A

T5 - Quantum Computing Devices and Materials

10:20 AM - 11:50 AM | Ballroom B

Invited Speakers：
● Xavier Jehl, CEA Grenoble
● Tomohiro Otsuka, Tohoku University
● Wei-Ti Liu, Quantum Technology, LLC

T6 - FeFET Devices and Applications

10:20 AM - 11:40 AM | Ballroom C

D5 - GaN/SiC Electronics

10:20 AM - 11:50 AM | Ballroom D

Invited Speakers：
● Cheng-Tyng Yen, Fast SiC Semiconductor Inc.
● Tian-Li Wu, National Yang Ming Chiao Tung University
● TBD

D6 - System Security, Memory, and ECO Design

10:20 AM - 11:20 AM | Mezzanine A+B

12:50 PM

J4 - Silicon-Based Evolution: Training and Transforming a New Category of Intelligent Beings

12:50 PM - 1:30 PM | Ballroom B

Invited Speakers：
● Edward Wei, Realtek Semiconductor Corporation

1:40 PM

T7 - Emerging Technologies for High-Performance Computing

1:40 PM - 5:00 PM | Ballroom A

Invited Speakers：
● Steven M. George, University of Colorado Boulder
● Wilhelmus Mathijs Marie Kessels, Eindhoven University of Technology
● Andrew J. Mannix, Stanford University
● Mengjie Yu, University of California, Berkeley
● Ming-Chang Lee, National Hsing Hua University
● Zaijun Chen, UC Berkeley
● Christian Haffner, imec

J5 - Neuromorphic Computing, AI and High Performance Processors

1:40 PM - 5:00 PM | Ballroom B

Invited Speakers：
● Adrian M. Ionescu, École Polytechnique Fédérale de Lausanne (EPFL)
● Hussam Amrouch, Technical University of Munich
● Udayan Ganguly, Indian Institute of Technology Bombay
● Kentaro Sano, RIKEN
● Kei Hiraki, Preferred Networks, Inc.
● Yasuo Ishii, Tenstorrent Inc.

D7 - Hardware Friendly Model Optimization for Compute Intensive Applications

1:40 PM - 3:00 PM | Ballroom C

D8 - Advances in Physical Design for Chips and Packages

1:40 PM - 3:00 PM | Ballroom D

T8 - Magnetic Devices and Applications

1:40 PM - 3:00 PM | Mezzanine A+B

3:20 PM

T9 - Heterogeneous Devices and Integration

3:20 PM - 5:00 PM | Mezzanine A+B

3:30 PM

D9 - 3D Integration Circuit

3:30 PM - 5:00 PM | Ballroom C

Invited Speakers：
● Takayuki Ohba, Institute of Science Tokyo
● Yoyo Li, Siemens EDA
● Chung-Ching Peng, Intel Corporation

D10 - Design and Test of Systems in Advanced Technology

3:30 PM - 4:50 PM | Ballroom D

2025.04.24

8:30 AM

J6 - Plenary Session

8:30 AM - 10:10 AM | Ballroom B

Invited Speakers：
● Farid Medjdoub, Centre national de la recherche scientifique, CNRS
● Shuo-Wei Chen, University of Southern California

10:20 AM

T10 - Modules for 2D Channel FET

10:20 AM - 11:20 AM | Ballroom A

T11 - Advanced Memory Technology

10:20 AM - 11:50 AM | Ballroom B

Invited Speakers：
● Wanki Kim, Samsung Electronics
● Kechao Tang, Peking University
● Hang-Ting Lue, Macronix International Co., Ltd.

D11 - Hardware Security

10:20 AM - 12:20 PM | Ballroom C

Invited Speakers：
● Makoto Nagata, Kobe University
● Yong Ki Lee, Samsung Electronics Co., Ltd.
● Takeshi Sugawara, The University of Electro-Communications
● Kaiyuan Yang, Rice University

D12 - How AI changes EDA (and vice versa): Vendor Perspectives

10:20 AM - 11:20 AM | Ballroom D

Invited Speakers：
● Ko-Lung Yuan, Siemens EDA
● Kenny Chen, Synopsys
● MJ Lai, Cadence

T12 - Wide Bandgap Devices for Power and RF

10:20 AM - 12:00 PM | Mezzanine A+B

11:25 AM

T13 - Oxide Semiconductor Transistors

11:25 AM - 12:45 PM | Ballroom A

11:30 AM

D14 - Advanced SRAM and AI-Driven Supply Chain Innovations

11:30 AM - 12:30 PM | Ballroom D

Invited Speakers：
● Nicky Lu, Etron Technology, Inc.
● Hidehiro Fujiwara, TSMC
● Bill Fong, Micron Technology, Inc.

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