Monday, April 21, 1:30 PM~4:50 PM Ballroom A

Tutorial 1 ： Advancement on Device Simulation, Modeling and Reliability
Chair(s)： Ya-Chin King, National Hsing Hua University

1:30 PM~2:30 PM
Tutorial 1-1 Electronic Devices Working at Low Temperatures for Novel Applications

Kuo-Hsing Kao, National Cheng Kung University

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2:30 PM~3:30 PM
Tutorial 1-2 Challenges and Opportunities of Compact Modeling in the AI Era

Yi-Hung Tsai, TSMC

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3:50 PM~4:50 PM
Tutorial 1-3 WLR Reliability in Advanced Technologies

Pei-Jean Liao, TSMC

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Monday, April 21, 1:30 PM~4:50 PM Ballroom B

Tutorial 2 ： Advanced Interconnect and Packaging Technologies
Chair(s)： Chuei-Tang Wang, TSMC

1:30 PM~2:30 PM
Tutorial 2-1 Strategic Directions for Advanced Packaging

Subramanian S. Iyer, University of California, Los Angeles

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2:30 PM~3:30 PM
Tutorial 2-2 HBM Technology and Challenges

Kangwook Lee, SK HYNIX INC.

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3:50 PM~4:50 PM
Tutorial 2-3 Advanced Substrate for High Performance Heterogeneous Integration

Yu-Hua Chen, Unimicron

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Monday, April 21, 1:30 PM~6:15 PM Ballroom C

Tutorial 3 ： Emerging Technologies for Automotive Electronics
Chair(s)： Chung-Hsun Huang, National Cheng Kung University

1:30 PM~3:00 PM
Tutorial 3-1 Automotive Applications in Advanced Process Nodes: Challenges and Solutions

Jui-Cheng Huang, TSMC

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3:15 PM~4:45 PM
Tutorial 3-2 Emerging Technologies for Automotive Displays

Shang-Li Chen, Himax Technologies, Inc.

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4:45 PM~6:15 PM
Tutorial 3-3 ADAS Product Development Practice - R&D to Mass Production

Ching-Lung Su, National Yunlin University of Science and Technology

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PAGE CONTENTS

-Tutorial 1 :
Advancement on Device Simulation, Modeling and Reliability
-Tutorial 2 :
Advanced Interconnect and Packaging Technologies
-Tutorial 3 :
Emerging Technologies for Automotive Electronics

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