|WELCOME
With a history dating back to 1983, the Symposium has solidified its position as the premier event on VLSI in Taiwan and a leading technology symposium worldwide for over four decades.
For maximizing the synergy across two symposia, from 2023 and beyond, the VLSI-TSA and VLSI-DAT symposia had been merged into one Symposium. We are confident the symposium will continue to create new opportunities and more communication platforms either Taiwan’s semiconductor industry or the global semiconductor industry and even academia and Institute.
During 2025 VLSI TSA, experts from industry and academia around the world will share their valuable insights on the latest technologies in the field of VLSI. For the keynote sessions, Prof. Suman Datta from Georgia Tech; Dr. Ken Rim, the Corporate EVP of Samsung and Dr. Farid Medjdoub from CNRS will deliver the keynote speeches related to “The Future of Microelectronics is in Transistors”, “Paths Forward for CMOS Technology in Angstrom Era” and “Wide Bandgap Power Electronics”. Additionally, Prof. Makoto Ikeda from the University of Tokyo, Dr. Ken Chang, Senior Vice President at Marvell Technology, and Professor Shuo Wei Chen from the University of Southern California will also present highly anticipated talks at the symposium.
Furthermore, the symposium’s technical committee has curated seven special sessions, two industrial sessions, and three tutorials, bringing together leading experts from industry, academia, and research sectors for face-to-face exchanges and knowledge sharing.
We look forward to your participation in the 2025 VLSI TSA and hope you have a memorable experience in Taiwan!
For further details on the symposium agenda, please continue to follow the official website.
Advised by:
Ministry of Economic Affairs, R.O.C.
Ministry of Education
National Science and Technology Council
Organized by:
Industrial Technology Research Institute
In cooperation with:
AI on Chip Taiwan Alliance
Consolidation and Promotion Center for Intelligent System On Chip, Ministry of Education
Heterogeneous Integration and Chiplet System Package Alliance
Power Electronic System Consortium
Taiwan IC Design Society
Taiwan Semiconductor Industry Association
The Chinese Institute of Electrical Engineering
IEEE Technical Co-Sponsors: