Monday, April 21, 1:30 PM~4:50 PM Ballroom A

Tutorial 1 ： Advancement on Device Simulation, Modeling and Reliability

• 
  1:30 PM~2:30 PM

  Tutorial 1-1 Cryogenic Electronic Devices for High Performance Computing and Quantum Computing
  

  Kuo-Hsing Kao, National Cheng Kung University
  

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• 
  2:30 PM~3:30 PM

  Tutorial 1-2 Challenges and Opportunities of Compact Modeling in the AI Era
  

  Yi-Hung Tsai, TSMC
  

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• 
  3:50 PM~4:50 PM

  Tutorial 1-3 WLR Reliability in Advanced Technologies
  

  Pei-Jean Liao, TSMC
  

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Monday, April 21, 1:30 PM~4:50 PM Ballroom B

Tutorial 2 ： Advanced Interconnect and Packaging Technologies

• 1:30 PM~2:30 PM

  Tutorial 2-1 TBD
  

  Subramanian S. Iyer, University of California, Los Angeles
  

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• 
  2:30 PM~3:30 PM

  Tutorial 2-2 HBM Opportunities and Challenges
  

  Kangwook Lee, SK HYNIX INC.
  

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• 
  3:50 PM~4:50 PM

  Tutorial 2-3 Substrate Development for the Advanced Heterogeneous Integration
  

  Dyi-Chung Hu, SiPlus CO., LTD.
  

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Monday, April 21, 1:30 PM~6:15 PM Ballroom C

Tutorial 3 ： Emerging Technologies for Automotive Electronics

• 
  1:30 PM~3:00 PM

  Tutorial 3-1 Automotive Applications in Advanced Process Nodes: Challenges and Solutions
  

  Jui-Cheng Huang, TSMC
  

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• 
  3:15 PM~4:45 PM

  Tutorial 3-2 Emerging Technologies for Automotive Displays
  

  Shang-Li Chen, Himax Technologies, Inc.
  

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• 
  4:45 PM~6:15 PM

  Tutorial 3-3 ADAS Product Development Practice - R&D, Planning, Mass Production, and Business
  

  Ching-Lung Su, National Yunlin University of Science and Technology
  

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PAGE CONTENTS

• -Tutorial 1 :
   Advancement on Device Simulation, Modeling and Reliability
• -Tutorial 2 :
   Advanced Interconnect and Packaging Technologies
• -Tutorial 3 :
   Emerging Technologies for Automotive Electronics