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Tuesday, April 23, 3:20 PM~4:50 PM Ballroom A
T4 ： Novel Quantum Computing Devices and Materials

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    3:20 PM~3:50 PM
    T4-1 Semiconductor spin qubits from lab to fab: recent progress and perspectives
    Louis Hutin, CEA-Leti
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    3:50 PM~4:20 PM
    T4-2 Trends and Prospects of Silicon Quantum Bit Research
    Tetsuo Kodera, Tokyo Institute of Technology
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    4:20 PM~4:50 PM
    T4-3 Device Implications and Optimization for Cryo-CMOS
    Nick Chiang, Taiwan Semiconductor Manufacturing Company, Ltd.

Wednesday, April 24, 10:20 AM~11:50 AM Ballroom B
T7 ： 3D Transistor Generation-Device Technology and Application

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    10:20 AM~10:50 AM
    T7-1 The historical development of non-planar devices
    Digh Hisamoto, Hitachi, Ltd.
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    10:50 AM~11:20 AM
    T7-2 Process Technology Innovation for Performance Improvements in the Era of Horizontal Gate-All-Around (hGAA) Devices
    Nicolas Breil, Applied Materials
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    11:20 AM~11:50 AM
    T7-3 10th Anniversary on the Discovery of Third Breakdown: Implications and Applications
    Steve S Chung, National Yang Ming Chiao Tung University

Wednesday, April 24, 1:40 PM~5:30 PM Ballrom A
T9 ： Emerging Technologies for High-performance Computing

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    1:40 PM~2:10 PM
    T9-1 2D Semiconductors from Spin-on Molecular Chemistries for Direct Large-Scale Integration
    Zakaria Al Balushi, UC Berkeley
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    2:10 PM~2:40 PM
    T9-2 Wafer-scale 3D Integration of 2D Materials
    Saptarshi Das, Penn State University
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    2:40 PM~3:10 PM
    T9-3 Quantum Computing with Silicon Spins
    Dominik Zumbuhl, University of Basel
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    3:30 PM~4:00 PM
    T9-4 Architectural Challenge for Cryogenic Superconductor Computing
    Koji Inoue, Kyushu University
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    4:00 PM~4:30 PM
    T9-5 The need for new materials in silicon photonics to enhance data througput
    Dries Van Thourhout, Ghent University & imec
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    4:30 PM~5:00 PM
    T9-6 Modeling GAA nanosheet devices accounting for quantum-mechanical effects down to cryo temperature
    Luca Larcher, Applied Materials
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    5:00 PM~5:30 PM
    T9-7 Solving 3D-IC Multiphysics Challenges With A Novel ML-Assisted Co-Optimization Methodology
    Lang Lin, Ansys Inc.

Thursday, April 25, 10:20 AM~11:50 AM Ballroom B
T12 ： Advanced Memory Technology

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    10:20 AM~10:50 AM
    T12-1 Unconventional Spin-Orbit Torques (SOT) in Sputtered Materials for High Density High Speed MRAM
    Shan X. Wang, Stanford University
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    10:50 AM~11:20 AM
    T12-2 Chalcogenide selectors for low voltage and high density memory applications
    Elia Ambrosi, Taiwan Semiconductor Manufacturing Company, Ltd.
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    11:20 AM~11:50 AM
    T12-3 Hafnia-based (Anti-)Ferroelectric Devices for Next-generation High-speed Dense Memory 
    Sou-Chi Chang, Intel Corporation

Wednesday, April 24, 10:20 AM~11:50 AM Ballroom D
D3 ： Reliability

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    10:20 AM~10:50 AM
    D3-1 Measurement Evaluation of BTI-induced Degradation Using Ring Oscillators
    Ryo Kishida, Toyama Prefecture University
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    10:50 AM~11:20 AM
    D3-2 Radiation-induced Soft Errors in Digital Circuits
    Jun Furuta, Kyoto Institute of Technology
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    11:20 AM~11:50 AM
    D3-3 Using Commercial Foundry Technology to Design Reliable ASICs for Aerospace Applications
    Marcel van de Burgwal, imec

Wednesday, April 24, 3:30 PM~5:00 PM Ballroom C
D8 ： High-Performance Computing for AI

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    3:30 PM~4:00 PM
    D8-1 Computational Network-on-Chip as Convolution Engine
    Zhonghai Lu, KTH Royal Institute of Technology
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    4:00 PM~4:30 PM
    D8-2 Application-Architecture Mapping for Energy-efficiency and High-Performance in Network-on-Chip-based Manycore Architectures
    Md Farhadur Reza, Eastern Illinois University
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    4:30 PM~5:00 PM
    D8-3 Exploiting HPC Techniques to Parallelise Simulation of 10B+ Transistor SoCs
    Jonathan Balkind, University of California, Santa Barbara

Thursday, April 25, 10:20 AM~11:50 AM Ballroom C
D11 ： Edge Computing

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    10:20 AM~10:50 AM
    D11-1 Enhancing Efficiency of Communication Assistive Devices with AI Technology
    Ying-Hui Lai, National Yang Ming Chiao Tung University
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    10:50 AM~11:20 AM
    D11-2 Heterogeneous Hardware Acceleration Methodology on SoC FPGA Using High Level Synthesis
    Chi-Chia Sun, National Taipei University
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    11:20 AM~11:50 AM
    D11-3 A Low-power Convolutional Neural Network Implemented in 40-nm CMOS Technology for Bearing Fault Diagnosis
    Yu-Pei Liang, National Chung Cheng University

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