Monday, April 22, 1:30 PM~4:50 PM Ballroom A

Tutorial 1 ： Emerging High Performance, Energy- Efficient CMOS Materials and Device

• 
  1:30 PM~2:30 PM

  Tutorial 1-1 SRAM with Emerging Technologies
  

  Vita Pi-Ho Hu, National Taiwan University
  

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• 
  2:30 PM~3:30 PM

  Tutorial 1-2 Ultra-low Voltage CMOS with Steep Swing Devices at Room and Cryogenic Temperatures
  

  Darsen Duane Lu, National Cheng Kung University
  

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• 
  3:50 PM~4:50 PM

  Tutorial 1-3 Birth of A New Field: Advances in 2D Electronics
  

  Chao-Hui Yeh, National Tsing Hua University
  

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Monday, April 22, 1:30 PM~4:50 PM Ballroom B

Tutorial 2 ： Advanced Interconnect and Packaging Technologies

• 
  1:30 PM~3:00 PM

  Tutorial 2-1 Advanced System Integration Technology Trend of HPC and GAI
  

  Kuo-Chung Yee, Taiwan Semiconductor Manufacturing Company, Ltd.
  

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• 
  3:20 PM~4:50 PM

  Tutorial 2-2 Review of Heterogeneous Integration technology
  

  Dyi-Chung Hu, SiPlus Co.
  

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Monday, April 22, 1:30 PM~6:15 PM Ballroom C

Tutorial 3 ： Design of Data-Intensive Computing Architectures

• 
  1:30 PM~3:00 PM

  Tutorial 3-1 Introduction to In- and Near-Memory Computing
  

  Tsung-Te Liu, National Taiwan University
  

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• 
  3:15 PM~4:45 PM

  Tutorial 3-2 In-Memory Computing: Cross-Layer Design from Devices to Applications
  

  Xiaobo Sharon Hu, University of Notre Dame
  

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• 
  4:45 PM~6:15 PM

  Tutorial 3-3 Network on Chip (NoC)-based Deep Neural Network Design Framework: From Algorithms to Architectures
  

  Kun-Chih Chen, National Yang Ming Chiao Tung University
  

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PAGE CONTENTS

• -Tutorial 1 :
   Emerging High Performance, Energy- Efficient CMOS Materials and Device
• -Tutorial 2 :
   Advanced Interconnect and Packaging Technologies
• -Tutorial 3 :
   Design of Data-Intensive Computing Architectures