Tuesday, April 23, 10:30 AM~12:10 PM Ballroom A+B

J1 ： Plenary Session

Chair(s)： Chih-Wei Liu, National Yang Ming Chiao Tung University
Steve Chung, National Yang Ming Chiao Tung University

• 
  10:30 AM~11:20 AM

  J1-1 IOWN, Photonics Technology Enables Next Generation Sustainable ICT Infrastructure
  

  Yosuke Aragane, NTT
  

  View Biography
• 
  11:20 AM~12:10 PM

  J1-2 CMOS Scaling by Nanosheet Device Architectures and Backside Engineering
  

  Naoto Horiguchi, imec

  View Biography

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Wednesday, April 24, 8:30 AM~10:10 AM Ballroom B

J3 ： Plenary Session

Chair(s)： Wenchi Ting, United Microelectronics Corporation
Chih-Tsun Huang, National Tsing Hua University

• 
  8:30 AM~9:20 AM

  J3-1 Ferroelectrics for Enhanced Semiconductor Devices
  

  Thomas Mikolajick, TU Dresden and NaMLab gGmbH
  

  View Biography
• 
  9:20 AM~10:10 AM

  J3-2 Enabling AI Revolution Through Innovations in Advanced Packaging & Chiplet Technology
  

  Raja Swaminathan, AMD
  

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Thursday, April 25, 8:30 AM~10:10 AM Ballroom B

J6 ： Plenary Session

Chair(s)： Tri-Rung Yew, National Tsing Hua University
Atsushi Takahashi, Tokyo Institute of Technology

• 
  8:30 AM~9:20 AM

  J6-1 Latest Trends in Technological Development Related to SiC Power Semiconductors
  

  Yasunori Tanaka, AIST
  

  View Biography
• 
  9:20 AM~10:10 AM

  J6-2 3D Stacking Process Technologies for Advanced CMOS Image Sensors
  

  Yoshihisa Kagawa, Sony
  

  View Biography

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PAGE CONTENTS

• -J1 :
   Plenary Session
• -J3 :
   Plenary Session
• -J6 :
   Plenary Session