Tuesday, April 23, 10:30 AM~12:10 PM Ballroom A+B
J1 Plenary Session

  • the photo of Speaker
    10:30 AM~11:20 AM
    J1-1 IOWN, Photonics Technology Enables Next Generation Sustainable ICT Infrastructure
    Yosuke Aragane, NTT
  • the photo of Speaker
    11:20 AM~12:10 PM
    J1-2 CMOS Scaling by Nanosheet Device Architectures and Backside Engineering
    Naoto Horiguchi, imec

Wednesday, April 24, 8:30 AM~10:10 AM Ballroom B
J3 Plenary Session

  • the photo of Speaker
    8:30 AM~9:20 AM
    J3-1 Ferroelectrics for Enhanced Semiconductor Devices
    Thomas Mikolajick, TU Dresden and NaMLab gGmbH
  • the photo of Speaker
    9:20 AM~10:10 AM
    J3-2 Enabling AI Revolution Through Innovations in Advanced Packaging & Chiplet Technology
    Raja Swaminathan, AMD

Thursday, April 25, 8:30 AM~10:10 AM Ballroom B
J6 Plenary Session

  • the photo of Speaker
    8:30 AM~9:20 AM
    J6-1 Latest Trends in Technological Development Related to SiC Power Semiconductors
    Yasunori Tanaka, AIST
  • the photo of Speaker
    9:20 AM~10:10 AM
    J6-2 3D Stacking Process Technologies for Advanced CMOS Image Sensors
    Yoshihisa Kagawa, Sony

Top