2022 VLSI-TSA Committees

 
General Chair and Co-chair
Advisory Committee 
Steering Committee
Technical Program Committee
 
  -North America Subcommittee
   -Europe Subcommittee
Local Organizing Committee

General Chairs
Toshiro Hiramoto, Chair
The University of Tokyo, Japan
Chih-I Wu, Chair
Industrial Technology Research Institute, Taiwan
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Advisory Committee
(Charles) Kin P. Cheung, NIST, USA 
Chorng-Ping ChangApplied Materials, USA
Shinichi TakagiThe University of Tokyo, Japan
An Chen, IBM, USA 
Steve ChungNational Yang Ming Chiao Tung University  
 
Steering Committee
Lewis Terman, IBM, USA
Morris Chang, TSMC, Taiwan
John Y. Chen, NVIDIA, USA
Tze-Chiang Chen, IBM, USA
Alice M. Chiang, Teratech, USA
Sanford Chu, XMC, China
Ben M.Y. Hsiao, IBM Emeritus, USA
Genda Hu, FocalTech Systems, Taiwan
Roger De Keersmaecker, RDK Consulting & Coaching, Belgium
G. P. Li, UC Irvine, USA
Rich Liu, Macronix International Co., Ltd., Taiwan
T. P. Ma, Yale Univ., USA
Tak H. Ning, IBM, USA
Jack Sun, TSMC, Taiwan
Paul P. Wang, Duke University, USA
Clement H. Wann, TSMC, Taiwan
H.-S. Philip Wong, Stanford University, USA
Ran H. Yan, Starix Technology, USA
Ping Yang, Intevac, USA
Hwa Nien Yu, IBM Emeritus, USA
Yee-Chia Yeo, TSMC, Taiwan
 
Technical Program Committee
Peide Ye, Chair 
Purdue University, USA
Wei-Chung Lo, Chair
Industrial Technology Research Institute, Taiwan 

-North America Subcommittee
Gary Chen, Chair
TSMC, USA
 
Wilman Tsai, Stanford University, USA
Jason Campbell, NIST, USA 
Robert D. Clark, TEL Technology Center, America, LLC, USA
Eric Pop, Stanford University, USA 
Patrick Fay, University of Notre Dame, USA
Andrew C. Kummel, University of California, San Diego, USA
Nicolas L. Breil, Applied Materials, USA
Sapan Agarwal, Sandia National Laboratories, USA
Prashant Majhi, Intel, USA
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-Europe Subcommittee  
Ionut Radu, Chair
SOITEC, France
 
Jean-Pierre Raskin, Université catholique de Louvain, Belgium
Robert Strenz, Infineon Technologies Dresden, Germany
François Andrieu, CEA, France
Naoto Horiguchi, imec, Belgium

-Asia Pacific Subcommittee
Toshifumi Irisawa, Co-chair
National Institute of Advanced Industrial Science and Technology (AIST), Japan
Ru Huang, Co-chair
Peking University, China 
Chee-Wee Liu, Co-chair
National Taiwan University, Taiwan
 
Wenchi Ting, UMC, Taiwan
S. Z. Chang, Powerchip Semiconductor Manufacture Corporation, Taiwan 
Dai-Ying Lee, Macronix International Co., Ltd., Taiwan
Wen-Kuan Yeh, Taiwan Semiconductor Research Institute, Taiwan
Bing-Yue Tsui, National Chiao Tung University, Taiwan
Chrong Jung Lin, National Tsing Hua University, Taiwan
Chen-Hsin Lien, National Tsing Hua University, Taiwan
Jeng-Ya David Yeh, TSMC, Taiwan
Wen Yueh Jang, Powerchip Semiconductor Manufacture Corporation, Taiwan 
Jiro Ida, Kanazawa Institute of Technology, Japan
Satofumi Souma, Kobe University, Japan
Dandan Zhao, KIOXIA Corporation, Japan 
Tetsu Ohtou, Tokyo Electron, Japan
Mansun Chan, Hong Kong University of Science and Technology, China
Zhiping Yu, Tsinghua University, China
Huaqiang Wu, Tsinghua University, China
Jin-Feng Kang, Peking University, China
Yi Zhao, Zhejiang University, China
Peng Zhou, Fudan University, China
Dongwon Kim, Samsung, Korea
Kin-Leong Pey, Singapore University of Technology and Design, Singapore
Samit Kumar Ray, IIT KGP, India
Hyoungsub Kim, Sungkyunkwan University, Korea
Xiao GONG, National University of Singapore, Singapore 
 
 
Local Organizing Committee (Industrial Technology Research Institute)
Chair: Emily Kuo
Co-chair: Wen-Chi Yang
General Secretariat: Emily Kuo
Secretariat: Caroline Huang
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