Scope of Papers
The scope of papers requested in 2022 VLSI-TSA includes the following fields :
• Front-end CMOS and foundry technology
• Standalone memory: DRAM, FLASH, emerging memory technology
• Ultra-low power CMOS and embedded memory
• Advanced process modules: e.g. gate stack, junction, strain/channel engineering, low-R
contact, low-C spacer/ILD, interconnect technology, ALE and selective deposition, etc.
• Nano-patterning: multiple patterning, directed self-Assembly, EUV, etc.
• Power and analog IC device and technology
• Advanced CMOS process and devices: Ge, SiGe, III-V, FinFET, GAAFET, low-dimensional materials and devices, 2D and nanowire devices
• BEOL compatible devices for 3D integration
• Material, process and device modeling
• Reliability physics, characterization and measurements
• Advanced packaging and 2.5D/3D Integration
• TFT and organic electronics
• MEMS, imagers and sensors
• Power and analog IC devices and technology
• Photonics and beyond CMOS technology
• RF & THz process, device and integration technology
• Energy harvesting technology • Wearable and loE enabling technologies
• Quantum phenomena and information technologies
• Neuromorphic devices and materials for brain-inspired computing
• Device/circuit technologies for AI deep learning applications
• Advanced manufacturing technology, metrology and yield