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Tuesday, April 19, 10:10 AM~12:00 PM Ballroom B
J1 ： Joint Plenary Session
Chair(s)： Shinichi Takagi, The University of Tokyo (TSA)
Chih-Fang Huang, National Tsing Hua University (TSA)
Tim Cheng, The Hong Kong University of Science and Technology (HKUST), Hong Kong (DAT)
Chih-Tsun Huang, National Tsing Hua University, Taiwan (DAT)

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    10:10 AM~11:05 AM
    J1-1 Latest SiC Technology and the Application Examples of Mitsubishi Electrics
    Toru Matsuoka, Mitsubishi Electric Corporation
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    11:05 AM~12:00 PM
    J1-2 Bridging the Physical and Digital Worlds in Data-Driven Systems
    Boris Murmann, Stanford University

Wednesday, April 20, 8:20 AM~10:10 AM Ballroom B
J3 ： Joint Plenary Session
Chair(s)： Ionut Radu, Soitec (TSA)
Wei-Chung Lo, Industrial Technology Research Institute (TSA)
Donald Y.C. Lie, Texas Tech University, USA (DAT)
Chih-Tsun Huang, National Tsing Hua University, Taiwan (DAT)

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    8:20 AM~9:15 AM
    J3-1 Advanced Packaging Ecosystem: Challenges and Solutions
    Babak Sabi, Intel
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    9:15 AM~10:10 AM
    J3-2 Technology Challenges to IC Industry for Next Decade
    K. Lawrence Loh, MediaTek
    陸國宏

Thursday, April 21, 8:20 AM~10:10 AM Ballroom B
J6 ： Joint Plenary Session
Chair(s)： Steve Chung, National Yang Ming Chiao Tung University (TSA)
Cheng-Wen Wu, Industrial Technology Research Institute, Taiwan (DAT)

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    8:20 AM~9:15 AM
    J6-1 Challenges and Opportunities in AI Hardware Design
    Jeff Burns, IBM
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    9:15 AM~10:10 AM
    J6-2 Semiconductor Evolution for Chip and System Design- From 2D Scaling to 3D Heterogeneous Integration
    L.C. Lu, TSMC
    魯立忠

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