Scope of Papers

   The scope of papers requested in 2022 VLSI-TSA includes the following fields : 

  •  Front-end CMOS and foundry technology
  •  Standalone memory: DRAM, FLASH, emerging memory technology
  •  Ultra-low power CMOS and embedded memory 
  •  Advanced process modules: e.g. gate stack, junction, strain/channel engineering, low-R 
     contact, low-C spacer/ILD, interconnect technology, ALE and selective deposition, etc.
  •  Nano-patterning: multiple patterning, directed self-Assembly, EUV, etc.
  •  Power and analog IC device and technology  
  •  Advanced CMOS process and devices: Ge, SiGe, III-V, FinFET, GAAFET, low-dimensional materials and devices, 2D and nanowire devices 
  •  BEOL compatible devices for 3D integration
  •  Material, process and device modeling 
  •  Reliability physics, characterization and measurements
  •  Advanced packaging and 2.5D/3D Integration
  •  TFT and organic electronics
  •  MEMS, imagers and sensors
  •  Power and analog IC devices and technology
  •  Photonics and beyond CMOS technology 
  •  RF & THz process, device and integration technology
  •  Energy harvesting technology
  •  Wearable and loE enabling technologies
  •  Quantum phenomena and information technologies
  •  Neuromorphic devices and materials for brain-inspired computing 
  •  Device/circuit technologies for AI deep learning applications
  •  Advanced manufacturing technology, metrology and yield