Advisory Committee

• Tim Cheng, Hong Kong University of Science and Technology

• S. C. Chien, United Microelectronics Corporation

• Kevin Jou, MediaTek Inc.

• Shye-Jye Jou, National Yang Ming Chiao Tung University

• Pei-Ing Lee, Nanya Technology Corporation

• Johnson Liao, Taiwan Auto Design Co. (TADC)

• Chih-Yuan Lu, Macronix International Co., Ltd.

• Yuh-Jier Mii, TSMC

• Jyuo-Min Shyu, National Tsing Hua University

• Jack Sun, National Yang Ming Chiao Tung University

• Brian Sung, Cadence Design Systems (Ireland) Limited Taiwan Branch

• H.-S. Philip Wong, Stanford University

• Jerry Wang, Hi-CHIP Heterogeneous Integration System-Level Packaging Development Alliance

• Cheng-Wen Wu, National Science and Technology Council