Thursday, April 16, 10:20 AM~11:20 AM Ballroom D

T11 ： Device/Interconnect Reliability

Chair(s)： Ernest Y. Wu, University of Vermont

• 
  10:20 AM~10:40 AM

  T11-1 Challenges of BEOL and MOL Dielectric TDDB Reliability
  

  Andrew Kim, Sandia National Laboratories
  

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• 
  10:40 AM~11:00 AM

  T11-2 Reliability and Aging Mechanisms in Deep Submicron CMOS Devices
  

  Maria Toledano Luque, GlobalFoundries
  

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• 
  11:00 AM~11:20 AM

  T11-3 Area-dependent Dielectric Breakdown: an Overlooked Yet Inevitable Physical Phenomenon
  

  Ernest Y. Wu, University of Vermont
  

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Thursday, April 16, 11:30 AM~12:30 PM Ballroom D

D12 ： Edge AI Accelerators

Chair(s)： Chih-Tsun Huang, National Tsing Hua University

• 
  11:30 AM~11:50 AM

  D12-1 Algorithm-to-Hardware: Enabling Ultra-Low-Power Edge AI through Direct RTL Conversion
  

  Jack Wu, DeepMentor Inc.
  

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• 
  11:50 AM~12:10 PM

  D12-2 Powering the Future of Agentic Edge AI - From IP to Your Own AI Chip
  

  William Wei, Skymizer Taiwan Inc.
  

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• 
  12:10 PM~12:30 PM

  D12-3 aiPIM - Processing in Memory DRAM
  

  TC Hsiao, Elite Semiconductor Microelectronics Technology Inc.
  

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PAGE CONTENTS

• -T11 :
   Device/Interconnect Reliability
• -D12 :
   Edge AI Accelerators