Asia Pacific Subcommittee

♦ Taiwan and Others

Chair:

Ya-Chin King, National Tsing Hua University

Members:

• Mansun Chan, The Hong Kong University of Science and Technology

• S. Z. Chang, Powerchip Semiconductor Manufacturing Corporation (PSMC)

• Xiao GONG, National University of Singapore

• Tuo-Hung Hou, National Yang Ming Chiao Tung University

• Wen Yueh Jang, Powerchip Semiconductor Manufacture Corporation (PSMC)

• Dong-Won Kim, Samsung Electronics Co., Ltd.

• Abhinav Kranti, Indian Institute of Technology

• Wook-hyun Kwon, Samsung Electronics Co., Ltd.

• Dai-Ying Lee, Macronix International Co., Ltd.

• Min-Hung Lee, National Taiwan University

• Chenhsin Lien, National Tsing Hua University

• Chrong-Jung Lin, National Tsing Hua University

• Jia-Min Shieh, Taiwan Semiconductor Research Institute (TSRI), NARLabs

• Wenchi Ting, United Microelectronics Corporation (UMC)

• Bing-Yue Tsui, National Yang Ming Chiao Tung University

• Wei-Chen Tu, National Cheng Kung University

♦ China

Chair:

Qian-Qian Huang, Peking University

Members:

• Ming He, Peking University

• Zhigang Ji, Shanghai Jiao Tong University

• Jin-Feng Kang, Peking University

• Han Li, Southeast University

• Huaqiang Wu, Tsinghua University

♦ Japan

Chair:

Kazuhiko Endo, Tohoku University

Members:

• Wen Hsin Chang, National Institute of Advanced Industrial Science and Technology (AIST)

• Jiro Ida, Kanazawa Institute of Technology

• Masaharu Kobayashi, The University of Tokyo

• Tetsu Ohtou, Tokyo Electron Ltd.

• Satofumi Souma, Kobe University