• IMPORTANT DATES: all are based on Taiwan time (GMT+8).
2. Notification of Acceptance: January 31, 2024
3. Deadline for Final Paper (IEEE compatible version) Submission: February 28, 2024
• Front-end CMOS and foundry technology
• Standalone memory: DRAM, FLASH, emerging memory technology
• Ultra-low power CMOS and embedded memory
• Advanced process modules: e.g. gate stack, junction, strain/channel engineering,
low-R contact, low-C spacer/ILD, interconnect technology, ALE and selective deposition,
etc.
• Nano-patterning: multiple patterning, directed self-assembly, EUV, etc.
• Advanced CMOS process and devices: Ge, SiGe, III-V, FinFET, GAAFET,
low-dimensional materials and devices, 2D and nanowire devices
• BEOL compatible devices for 3D integration
• Material, process and device modeling
• Reliability physics, characterization and measurements
• Advanced packaging and 2.5D/3D integration
• TFT and organic electronics
• MEMS, imagers and sensors
• Power and analog IC devices and technology
• Photonics and beyond CMOS technology
• RF & THz process, device and integration technology
• Energy harvesting technology
• Wearable and loE enabling technologies
• Quantum phenomena and information technologies
• Neuromorphic devices and materials for brain-inspired computing
• Device/circuit technologies for AI deep learning applications
• Advanced manufacturing technology, metrology and yield
• Emerging Materials and Devices
Ü PAPER SUBMISSION GUIDELINES
• Camera-ready manuscript (2 pages including figures and tables) should be submitted
electronically in PDF format through the symposium website at
• Accepted papers MUST be presented by one of the authors in person at the symposium to
guarantee publication in the symposium proceedings. Presentations will be in English and
will be limited to 15 minutes, with an additional 5 minutes for discussion.
• Any changes on the title or author list or withdrawal after acceptance must be approved by
Mentors or TSA Program Chairs.
• All papers presented at the symposium will be published in the proceedings as submitted
without revisions. Authors of accepted papers must transfer copyright to IEEE by utilizing
the electronic IEEE Copyright Form (eCF) for inclusion in the IEEE Xplore database.
• All paper presenters are required to register for the symposium.
• No-show papers will not be included in the symposium proceedings, nor will they be
submitted to the IEEE Xplore database.
Ü STUDENT SUBSIDY
• Student Travel Financial support for attending 2024 VLSI TSA is available for full-time
student presenters living outside of Taiwan.
Ü BEST STUDENT PAPER AWARD
• The selection will be based on the paper quality evaluated by technical committee members,
as well as the presentation of the paper at the symposium. The paper should be presented
by the key author who is a full-time student at the time of paper presentation. The Best
Student Paper Award will be presented to the winning student at the next year’s
symposium.
Ü LATE NEWS PAPERS
• A very limited number of high quality Late News Papers will be accepted.
Note that Late News Papers are not eligible for the best student paper award.