Tuesday, April 18, 1:40 PM~4:55 PM Ballroom B

J2 ： Sensors – Devices Circuit and Applications in Automotive/Drone

• 
  1:40 PM~2:15 PM

  J2-1 Imaging and Sensing Devices for Future Automotive World
  

  Yorito Sakano, Sony
  

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• 
  2:15 PM~2:50 PM

  J2-2 Small-Pixel Pseudo-dToF Image Sensors with Charge-domain Signal Compression
  

  Keiichiro Kagawa, Shizuoka University
  

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• 
  2:50 PM~3:25 PM

  J2-3 Vision Sensing in Automotive and its Applications
  

  Darren Chen, LITEON Technology Corp.
  

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• 
  3:45 PM~4:20 PM

  J2-4 Reposition of 4D Imaging radar in sensor-fusion system toward Autonomous Driving
  

  Naiheng Tseng, Wistron NeWeb Corp.
  

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• 
  4:20 PM~4:55 PM

  J2-5 CMOS SPAD Sensors for Solid-state LIDAR
  

  Istvan Gyongy, The University of Edinburgh
  

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Wednesday, April 19, 1:40 PM~6:05 PM Ballroom B

J5 ： Heterogeneous Integration

• 
  1:40 PM~2:15 PM

  J5-1 Heterogeneous Integration with 3D Chiplets
  

  Deepak Kulkarni, AMD Inc.
  

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• 
  2:15 PM~2:50 PM

  J5-2 Open, Extensible Platforms: the Key to Success in the Era of Bespoke Silicon and 3D-IC
  

  John Lee, Ansys Inc.
  

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• 
  2:50 PM~3:25 PM

  J5-3 Hybrid Bonding: The Key Technology to Reach Fine Pitch and High Density Stacking in Heterogeneous Integration
  

  Kuan-Neng Chen, National Yang Ming Chiao Tung University
  

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• 
  3:45 PM~4:20 PM

  J5-4 Thin Layer Transfer Technologies in Heterogeneous Integration
  

  Hankel (Cheng-Hung) Chang, Soitec
  

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• 
  4:20 PM~4:55 PM

  J5-5 Scaling Heterogenous Integration from Dies to Materials
  

  Subramanian (Subu) Iyer, University of California, Los Angeles
  

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• 
  4:55 PM~5:30 PM

  J5-6 Embracing the Full Power of TSMC 3DFabric^TM Design: Challenges and Solutions
  

  Yi-Kan Cheng, TSMC
  

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• 
  5:30 PM~6:05 PM

  J5-7 The Next Frontier: From SoC to Heterogenous Integration of Chiplets
  

  Don Chan, Cadence
  

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PAGE CONTENTS

• -J2 :
   Sensors – Devices Circuit and Applications in Automotive/Drone
• -J5 :
   Heterogeneous Integration