11:40 AM~12:00 PM
T7-5
Demonstration of A 3D Chip by Logic-DRAM Stacked Using Paired TSV Interconnection through Interface for AI/Edge-Computing Application
Chun-Lin Lu, Chun Cheng Chen, Sheng-Chieh Lin, Chih-Hao Chuang, Kai-Yao Shih, Hsin-Yi Liao, Chin-Hung Huang, Min-Syong Ju, Cheng-Shu Ho, Chi Ming Chen and Shou-Zen Chang
Powerchip Semiconductor Manufacturing Corporation