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Tuesday, April 18, 1:40 PM~4:55 PM Ballroom B
J2 ： Sensors – Devices Circuit and Applications in Automotive/Drone
Chair(s)： Wenchi Ting, UMC
Jiun-In Guo, National Yang Ming Chiao Tung University

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    1:40 PM~2:15 PM
    J2-1 Imaging and Sensing Devices for Future Automotive World
    Yorito Sakano, Sony
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    2:15 PM~2:50 PM
    J2-2 Small-Pixel Pseudo-dToF Image Sensors with Charge-domain Signal Compression
    Keiichiro Kagawa, Shizuoka University
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    2:50 PM~3:25 PM
    J2-3 Vision Sensing in Automotive and its Applications
    Darren Chen, LITEON Technology Corp.
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    3:45 PM~4:20 PM
    J2-4 Reposition of 4D Imaging radar in sensor-fusion system toward Autonomous Driving
    Naiheng Tseng, Wistron NeWeb Corp.
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    4:20 PM~4:55 PM
    J2-5 CMOS SPAD Sensors for Solid-state LIDAR
    Istvan Gyongy, The University of Edinburgh

Wednesday, April 19, 1:40 PM~6:05 PM Ballroom B
J5 ： Heterogeneous Integration
Chair(s)： Ionut Radu, Soitec
Shigeki Tomishima, Intel
Lih-Yih Chiou, National Cheng Kung University

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    1:40 PM~2:15 PM
    J5-1 Heterogeneous Integration with 3D Chiplets
    Deepak Kulkarni, AMD Inc.
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    2:15 PM~2:50 PM
    J5-2 Open, Extensible Platforms: the Key to Success in the Era of Bespoke Silicon and 3D-IC
    John Lee, Ansys Inc.
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    2:50 PM~3:25 PM
    J5-3 Hybrid Bonding: The Key Technology to Reach Fine Pitch and High Density Stacking in Heterogeneous Integration
    Kuan-Neng Chen, National Yang Ming Chiao Tung University
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    3:45 PM~4:20 PM
    J5-4 Thin Layer Transfer Technologies in Heterogeneous Integration
    Hankel (Cheng-Hung) Chang, Soitec
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    4:20 PM~4:55 PM
    J5-5 Scaling Heterogenous Integration from Dies to Materials
    Subramanian (Subu) Iyer, University of California, Los Angeles
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    4:55 PM~5:30 PM
    J5-6 Embracing the Full Power of TSMC 3DFabricTM Design: Challenges and Solutions
    Yi-Kan Cheng, TSMC
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    5:30 PM~6:05 PM
    J5-7 The Next Frontier: From SoC to Heterogenous Integration of Chiplets
    Don Chan, Cadence

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