North America Subcommittee

Chair:

Garry Chen, TSMC

Members:

• Nicolas L. Breil, Applied Materials

• Jason Campbell, NIST

• Robert D. Clark, TEL Technology Center, America, LLC

• Patrick Fay, University of Notre Dame

• Andrew C. Kummel, University of California, San Diego

• Prashant Majhi, Intel

• Eric Pop, Stanford University

• Wilman Tsai, Stanford University

• Max Wu, Intel