Asia Pacific Subcommittee

Co-Chairs:

Ya-Chin King, National Tsing Hua University

Ru Huang, Peking University

Toshifumi Irisawa, National Institute of Advanced Industrial Science and Technology (AIST)

Members:

• Wenchi Ting, UMC

• S. Z. Chang, Powerchip Semiconductor Manufacture Corporation

• Dai-Ying Lee, Macronix International Co., Ltd.

• Bing-Yue Tsui, National Yang Ming Chiao Tung University

• Chrong Jung Lin, National Tsing Hua University

• Chen-Hsin Lien, National Tsing Hua University

• Jeng-Ya David Yeh, TSMC

• Wen Yueh Jang, Powerchip Semiconductor Manufacture Corporation

• JianJang Huang, National Taiwan University

• Jia-Min Shieh, Taiwan Semiconductor Research Institute, NARlabs

• Tuo-Hung Hou, Taiwan Semiconductor Research Institute, NARlabs

• Dongwon Kim, Samsung

• Dae-Hyun Kim, Kyungpook National University

• Kin-Leong Pey, Singapore University of Technology and Design

• Xiao GONG, National University of Singapore

• Samit Kumar Ray, IIT KGP

• Mansun Chan, Hong Kong University of Science and Technology

• Huaqiang Wu, Tsinghua University

• Jin-Feng Kang, Peking University

• Yi Zhao, Zhejiang University

• Peng Zhou, Fudan University

• Ming He, Peking University

• Litao Sun, Southeast University

• Zhigang Ji, Shanghai Jiao Tong University 

• Jiro Ida, Kanazawa Institute of Technology

• Satofumi Souma, Kobe University

• Tetsu Ohtou, Tokyo Electron

• Dandan Zhao, KIOXIA Corporation