|Call for Papers
 
We appreciate your interest in submitting a paper to the Symposium. Herewith forms and the necessary information are provided for your preparation of the paper submission.

• IMPORTANT DATES: all are based on Taiwan time (GMT+8).
1. Deadline for Title/Abstract Submission: Oct. 15, 2022
2. Deadline for Camera-Ready Paper Submission: Nov. 01, 2022
3. Notification of Acceptance: Dec. 30, 2022
4. Deadline for Final Paper (IEEE compatible version) Submission: Jan. 31, 2023
5. Deadline for Author Registration: Feb. 28, 2023

• Original and unpublished papers on all aspects are solicited, including but not limited to:

Analog, Mixed-Signal & RF Design

Digital, Memory, and AI Chip Design

Application, System, Software and Hardware Architecture

Design Automation and Test Methodology

Emerging Technology

RF, Analog and Mixed Signal Circuits

  Communication Baseband  Designs

AI for Systems, and Systems for AI

AI for Design Automation & Test
 

Energy-Harvesting and Power Management Circuits

Computing-in-Memory

CPU, DSP and Multicore Architectures

Design Automation & Test for 3D and Interposer-Based IC
 

Biomedical Circuits

Digital Circuits and ASICs

Domain Specific Architectures and Accelerators

Design Automation & Test for AI Chips
 

Sensor and Interface Circuits

Hardware Security and Trust

Embedded System and Software

Design Automation & Test for Microfluidic Biochips
 

Wired and IO Design

Low Voltage & Low Power Circuits Design Ultra Low-Power Circuits and Systems

Hardware-efficient AI Methods

Design Automation & Test for RF, Analog and Mixed-Signal IC
 


Memory Circuits and Systems Multimedia Processing Designs
Design Automation & Test for System Level and SoC

  Memristive and Neuromorphic Circuits
SoC (System on Chip) and NoC (Network on Chip) Architectures
Design for Manufacturability
 
  Security Circuits for IoT and AI
Software/Hardware Co-Design and System Compiler
Design for Testability and BIST
 
  Specialized Hardware
SiP (System-in-Package) and Heterogeneous Integration Designs
Design Verification
 
      Hardware/Software Co-Design
 
      Logic and Behavioral Synthesis
 
      Modeling and Simulation
 
   Memory Test
 
   On-Chip Monitoring
 
   Physical Design and Verification
 
   Power/Thermal/Timing Estimation and Optimization
 
   Silicon Debug and Diagnosis
 
   Test Generation and Compression
 
   Test Standards
 
   Yield and Reliability Enhancement
 
 
Ü GENERAL INSTRUCTIONS
  • Prospective authors are asked to submit their work in two stages.
          → In Stage One (abstract submission), a title, an 80- to 100-word abstract, and a list of all
                 co-authors must be submitted via the conference submission page before Oct. 15, 2022
                 No abstract submissions after the deadline.
              In Stage Two (paper submission), authors must electronically submit the self-contained
                 paper with figures and tables via the same submission page before Nov. 01, 2022.
  • The submitted manuscript must be 2 or 4 pages, to ensure It is self-contained and contribution, double-columned, IEEE-style compatible, in PDF format only. Any submissions not adhering to the rules will be rejected immediately without review.
  • It adopts the double-blind review process; please DO NOT reveal your name(s) or affiliation(s) anywhere in the submitted manuscript for the first paper submission.
  • Before submitting your abstract/paper, please review the information on IEEE Intellectual Property Rights at https://www.ieee.org/web/publications/rights/index.html
  • The notices of acceptance will be sent out to authors on December 30, 2022
  • Any changes on the title and author list or withdrawal after acceptance must be approved by DAT symposium Program Chairs.
  • For an accepted paper to be published in the proceedings, one of its co-author(s) MUST register and attend the symposium to present the paper. Note that each accepted paper shall be accompanied by a distinct registration; that is, two registrations are required for presenting two papers even if the presenter is the same.
  • Presentation of accepted papers at the symposium must be in English. The final manuscripts of all accepted papers will be published as submitted in the proceedings.
  • No-show papers will not be included in the symposium proceedings and will not be submitted to the IEEE Xplore database.
  • Please refer to the detailed information on the conference website for authors: https://expo.itri.org.tw/2023VLSITSADAT
Ü STUDENT SUBSIDY
  • Financial supports are available for full-time student presenters living outside of Taiwan.
Ü BEST PAPER AWARD
  • Three best papers will be selected this year through a rigorous evaluation process conducted by the program committee and session chairs.