TSA Call For Papers

The 2023 International VLSI Symposium on Technology Systems and Applications will be held on April 17-20, 2023 at the Ambassador Hotel, Hsinchu, Taiwan. The symposium has been kicked-off since 1983. It is a premiere conference in Taiwan and received up to 1,000 participants every year. It provides a unique opportunity to network with VLSI leading experts worldwide. Original and unpublished papers on all aspects of advanced VLSI technology and applications are solicited.

Hsinchu City: The well-known Taiwan’s Silicon Valley is based with clusters of world-class high Tech. IC manufacturing and design. It is one-hour driving distance from Taipei, 40 minutes from the airport. Industry attendees may take this opportunity to visit Science Park business unit and academia attendees may visit major universities/Institutes of Taiwan, either in Hsinchu, or down to the south by the high speed train within one hour.

COVID-19 Watch: 2023 International VLSI Symposium on Technology Systems and Applications is planned for an in-person/on-site event. In the meantime, we will keep Hybrid meeting (same as 2022) if COVID-19 still keeps a threat to the convention, i.e., arranging overseas presenters to provide a pre-recorded video for presentation on condition that they render into travel restrictions.   

 Paper Submission Site click HERE

Papers in the following scope are solicited:
2023 TSA Paper Submission Guidelines:

The paper should be written in English.

Submissions of the 2-page camera-ready manuscript in pdf format, including figures and table.

In addition to the camera-ready manuscript, the submission should include an 100~200 word abstract. 

Upon acceptance of your paper, an electronic IEEE copyright form (eCF) is compulsory and must be submitted online via the Paper Submission Site. For more information about IEEE Copyright, please refer to the IEEE Copyright Policy site.
- No-show papers will not be included in the symposium   proceedings and will not be submitted to the IEEE Xplore   database.
- All paper presenters are required to register for the symposium before February 28, 2023 (GMT+8) and present at the symposium. 

  Important Dates :

-     Paper Submission Extended to
       November 14, 2022 (23:59 GMT+8)
-     Acceptance Notification
      December 30, 2022

-     Author Registration Deadline 
       February 28, 2023

Student Subsidy:
Financial support for full-time overseas student authors is available. 
Up to 65% discount for all students on registration fee. 
Best Student Paper Award:
The selection will be based on the paper quality evaluated by technical committee members, as well as the presentation of the paper at the symposium. The paper should be presented by the key author who is a full-time student at the time of paper presentation. The Best Student Paper Award will be presented to the winning student at the next year’s symposium.
Late News Papers: (Submission Deadline: Jan. 15, 2023)
A very limited number of high quality Late News Papers will be accepted.
Late News Papers are not eligible for the best student paper award.

For further information, please contact:                

Caroline Huang
Symposium Secretariat (TSA)

General Chair
Shih-Chieh Chang, Industrial Technology Research Institute

TSA Symposium Chair 
Peide Ye, Purdue University
TSA Program Chairs
Jenn-Gwo Hwu, National Taiwan University
Wei-Chung Lo, Industrial Technology Research Institute