l Front-end CMOS and foundry technology
l Standalone memory: DRAM, FLASH, emerging memory technology
l Ultra-low power CMOS and embedded memory
l Advanced process modules: e.g. gate stack, junction, strain/channel engineering, low-R contact, low-C pacer/ILD, interconnect technology, ALE and selective deposition, etc.
l Nano-patterning: multiple patterning, directed self-Assembly, EUV, etc.
l Power and analog IC device and technology
l Advanced CMOS process and devices: Ge, SiGe, III-V, FinFET, GAAFET, low-dimensional materials and devices, 2D and nanowire devices
l BEOL compatible devices for 3D integration
l Material, process and device modeling
l Reliability physics, characterization and measurements
l Advanced packaging and 2.5D/3D Integration
l TFT and organic electronics
l MEMS, imagers and sensors
l Power and analog IC devices and technology
l Photonics and beyond CMOS technology
l RF & THz process, device and integration technology
l Energy harvesting technology
l Wearable and loE enabling technologies
l Quantum phenomena and information technologies
l Neuromorphic devices and materials for brain-inspired computing
l Device/circuit technologies for AI deep learning applications
l Advanced manufacturing technology, metrology and yield