Thursday, April 21, 10:20 AM~11:20 AM Ballroom D

D10 ： EDA for Heterogeneous 2.5D/3D IC Integration

• 
  10:20 AM~10:40 AM

  D10-1 ML-based Fast On-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs
  

  Norman Chang, Ansys, Inc.
  

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• 
  10:40 AM~11:00 AM

  D10-2 2.5D & 3DIC Advanced Packaging: An EDA Perspective
  

  Vincent Hsu, Synopsys
  許學良

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• 
  11:00 AM~11:20 AM

  D10-3 Substrate Signal Routing Solution Exploration for High-Density Packages with Machine Learning
  

  Yi-Hung Chen, MediaTek Inc.
  陳逸宏

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Thursday, April 21, 11:30 AM~12:30 PM Ballroom D

D11 ： GaN and SiC Ecosystems for Power and RF Applications

• 
  11:30 AM~11:50 AM

  D11-1 Product Level Design Considerations & Solutions for RF GaN Applications
  

  Chih-Wen Huang, WIN Semiconductors Corporation
  黃智文

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• 
  11:50 AM~12:10 PM

  D11-2 Wide Band Gap Devices for Power System
  

  TaiKang Shing, Delta Electronics, Inc.
  邢泰剛

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• 
  12:10 PM~12:30 PM

  D11-3 The Applications of SiC Power Devices in Renewable Energy and EV
  

  Kung-Yen Lee, National Taiwan University and SiCEV Co. Ltd.
  李坤彥

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PAGE CONTENTS

• -D10 :
   EDA for Heterogeneous 2.5D/3D IC Integration
• -D11 :
   GaN and SiC Ecosystems for Power and RF Applications