Tuesday, April 19, 10:10 AM~12:00 PM Ballroom A+B

J1 ： Joint Plenary Session

• 
  10:10 AM~11:05 AM

  J1-1 Latest SiC technology and the application examples of Mitsubishi Electrics
  

  Toru Matsuoka, Mitsubishi Electric Corporation
  

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• 
  11:05 AM~12:00 PM

  J1-2 Bridging the Physical and Digital Worlds in Data-Driven Systems
  

  Boris Murmann, Stanford University
  鲍瑞思

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Wednesday, April 20, 8:20 AM~10:10 AM Ballroom B

J3 ： Joint Plenary Session

• 
  8:20 AM~9:15 AM

  J3-1 Advanced Packaging Ecosystem: Challenges and Solutions
  

  Babak Sabi, Intel
  

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• 
  9:15 AM~10:10 AM

  J3-2 Technology Challenges to IC Industry for Next Decade
  

  K. Lawrence Loh, MediaTek Inc.
  陸國宏

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Thursday, April 21, 8:20 AM~10:10 AM Ballroom B

J6 ： Joint Plenary Session

• 
  8:20 AM~9:15 AM

  J6-1 Challenges and Opportunities in AI Hardware Design
  

  Jeff Burns, IBM
  

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• 
  9:15 AM~10:10 AM

  J6-2 Semiconductor Evolution for Chip and System Design- From 2D Scaling to 3D Heterogeneous Integration
  

  L.C. Lu, TSMC
  魯立忠

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PAGE CONTENTS

• -J1 :
   Joint Plenary Session
• -J3 :
   Joint Plenary Session
• -J6 :
   Joint Plenary Session