2021 VLSI-TSA Symposium Agenda

* Please do not copy, download or disseminate any copyrighted content of 2021 International
Symposia on VLSI-TSA and VLSI-DAT without written consent from the authors.

* The program is subject to change without prior notice.

* All schedule is in Taiwan Time (GMT+8).

Time

Monday, April 19

Time

Tuesday, April 20

Time

Wednesday, April 21

Time

Thursday, April 22

09:00

09:50

Ballroom A+B

08:20

10:10

Ballroom B

08:30

10:10

Ballroom B

Joint Opening

Joint Opening & Award Ceremony

09:50 BREAK

J3: Joint Plenary Session

08:20 J3-1

Putting AI on Diet: TinyML and Efficient Deep Learning

Song Han
Massachusetts Institute of Technology

09:15 J3-2

Finding a Needle in a Haystack: Success Stories of Data Mining and Machine Learning for Electronic Materials Selection

Evan Reed
Stanford University

10:10 BREAK

J6: Joint Plenary Session

08:20 J6-1

Thoughts on the Future of Higher Education: Lessons from 20 Years of Experimentation at Olin College

Richard K. Miller
Olin College of Engineering

09:15 J6-2

Domain-specific In-memory Computing Architecture: CMOS Annealing Machine to Solve Combinatorial Optimization Problems

Masanao Yamaoka
Hitachi

10:10 BREAK

10:20

12:00

J1: Joint Plenary Session

09:50 J1-1

Logic Technology Scaling: Present and Future

Lipen Yuan
TSMC

11:05 J1-2

Electronic Skins for Robotics and Wearables

Takao Someya
The University of Tokyo

12:00 BREAK

10:20

12:40

Ballroom A

Ballroom B

Ballroom C

10:20

12:40

Ballroom A

Ballroom B

T6:

Special Session

Low Temperature Electronics

12:40 BREAK

J4-1:

Joint Special Session
Design-Technology
Co-Optimization and Advanced Packaging (I)

12:05 BREAK

T7:

Paper Session

Power and RF Devices

11:40 BREAK

T10:

Paper Session

Ferroelectrics-FETs and Memories

12:35 END

T11:

Special Session

Biomedical Sensors and Devices

12:40 END

12:50

13:40

Ballroom C

12:50

13:30

Ballroom B

T3: Poster Session

Time for exchanging ideas with the poster presenters

J5: Joint Luncheon Keynote
Ecosystem of IoT security– challenges and opportunities
Tung-Yi Chan
Winbond Electronics Corporation

Time

Ballroom A

Ballroom B

Time

Ballroom A

Ballroom B

Ballroom C

Mezzanine A+B

Time

Ballroom A

Ballroom B

13:30

16:50

TSA

Short Course A

Advanced Processing for Future Nodes

16:50 END

TSA

Short Course B

AI-Devices to Systems

16:50 END

13:40

17:55

T1:

Paper Session

Advanced CMOS Technology

15:20 BREAK

J2:

Joint Special Session
In-Memory Computing

15:25~15:45 BREAK

17:30 END

T3:

Poster Session

Poster Session

17:30 END

T4:

Paper Session

Non-Volatile Memories

15:55 BREAK

13:40

18:05

T8:

Special Session

Low Dimensional Materials and Devices

15:10~15:30
BREAK

16:50 END

J4-2:

Joint Special Session

Design-Technology
Co-Optimization and Advanced Packaging (II)

15:25 BREAK

15:40 START
T2:

Special Session

Heterogeneous Integration

17:25 END

16:15 START
T5:

Paper Session

Oxide Transistors and BEOL/Process Technology

17:55 END

15:45 START

T9:

Special Session

Hardware Security

18:05 END