The program is subject to change without prior notice.
Time
Monday, April 19
Tuesday, April 20
Wednesday, April 21
Thursday, April 22
09:00
09:50
Ballroom A+B
08:20
|
10:10
Ballroom B
08:30
Joint Opening
J3: Joint Plenary Session
08:20 J3-1
Thoughts on the Future of Higher Education: Lessons from 20 Years of Experimentation at Olin College
Richard K. MillerOlin College of Engineering
09:15 J3-2
Finding a Needle in a Haystack: Success Stories of Data Mining and Machine Learning for Electronic Materials Selection
Evan ReedStanford University
J6: Joint Plenary Session
08:20 J6-1
Putting AI on Diet: TinyML and Efficient Deep Learning
Song HanMassachusetts Institute of Technology
09:15 J6-2
Domain-specific In-memory Computing Architecture: CMOS Annealing Machine to Solve Combinatorial Optimization Problems
10:20
12:00
J1: Joint Plenary Session
09:50 J1-1
Logic Technology Scaling: Present and Future
Lipen YuanTSMC
11:05 J1-2
Electronic Skins for Robotics and Wearables
Takao SomeyaThe University of Tokyo
12:40
Ballroom A
Ballroom C
T6:
Special Session
Low Temperature Electronics
12:40 BREAK
J4-1:
Joint Special Session Design-Technology Co-Optimization and Advanced Packaging (I)
T7:
Paper Session
Power and RF Devices
T10:
Ferroelectrics-Transistors and Memories
T11:
Biomedical Sensors and Devices
12:50
13:40
13:30
T3: Poster Session
J5: Joint Luncheon Keynote Ecosystem of IoT security– challenges and opportunities Tung-Yi ChanWinbond Electronics Corporation
Mezzanine A+B
16:50
TSA
Short Course A
Advanced Processing for Future Nodes
16:50 END
Short Course B
AI-Devices to Systems
17:55
T1:
Advanced CMOS Technology
J2:
Joint Special Session
In-Memory Computing
15:25~15:55 BREAK
T3:
T4:
18:05
T8:
15:10~15:30 BREAK
J4-2:
Design-Technology Co-Optimization and Advanced Packaging (II)
15:25 BREAK
15:40 START T2:
Heterogeneous Integration
17:25 END
16:15 START T5:
Oxide Transistors and BEOL/Process Technology
17:55 END
Hardware Security
18:05 END