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Tuesday, August 11, 1:30 PM~5:20 PM Ballroom B
J2
:
Heterogeneous Integration: Technologies and Applications
1:30 PM~2:05 PM
J2-1
Advanced 3D Wafer Level System Integration Technology
Kuo-Chung Yee, TSMC
余國寵
View Biography
2:05 PM~2:40 PM
J2-2
3D Heterogeneous Integration Technology for AI System
Mitsumasa Koyanagi, Tohoku University and T-MicroTec. Co., Ltd.
View Biography
2:40 PM~3:15 PM
J2-3
Excursion Prevention Strategy to increase Chip Performance by Photomask Tuning
Ofir Sharoni, Carl Zeiss SMT
View Biography
3:35 PM~4:10 PM
J2-4
Miniaturized CMOS Imaging Device for Implantable
Kiyotaka Sasagawa, Nara Institute of Science and Technology
View Biography
4:10 PM~4:45 PM
J2-5
Wearables to Electronics: The Key Enabler for Personalized Healthcare
Jerald Yoo, National University of Singapore
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4:45 PM~5:20 PM
J2-6
Breath Analysis for Early Detection and Rapid Diagnosis of Diseases for Preventive Medicine
Kea-Tiong Tang, National Tsing Hua University
鄭桂忠
View Biography
Wednesday, August 12, 1:40 PM~4:55 PM Ballroom B
J5
:
Embedded Memory and Memory-Centric Computing
1:40 PM~2:15 PM
J5-1
Scaling of Split-Gate Flash Memory for Embedded Controllers and Machine Learning Applications
Nhan Do, Microchip Technology Inc.
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2:15 PM~2:50 PM
J5-2
Memory for Data-Centric Computing: A Technology Perspective
Yih Wang, TSMC
王奕
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2:50 PM~3:25 PM
J5-3
TaOx ReRAM as a highly-reliable embedded memory and its application to edge AI
Ryutaro Yasuhara, Panasonic Semiconductor Solutions Co., Ltd.
View Biography
3:45 PM~4:20 PM
J5-4
Compute-in-Memory for AI: From Inference to Training
Shimeng Yu, Georgia Institute of Technology
View Biography
4:20 PM~4:55 PM
J5-5
A Cost-Effective Embedded Nonvolatile Memory with Scalable LEE Flash
®
-G2 SONOS for Secure IoT and Computing-in-Memory (CiM) Applications
Koji Nii, Floadia Corp.
View Biography
PAGE CONTENTS
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J2 :
Heterogeneous Integration: Technologies and Applications
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J5 :
Embedded Memory and Memory-Centric Computing
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