1:30 PM~2:05 PM
J2-1 Advanced 3D Wafer Level System Integration Technology

Kuo-Chung Yee, TSMC
2:05 PM~2:40 PM
J2-2 3D Heterogeneous Integration Technology for AI System

Mitsumasa Koyanagi, Tohoku University and T-MicroTec. Co., Ltd.
2:40 PM~3:15 PM
J2-3 Excursion Prevention Strategy to increase Chip Performance by Photomask Tuning

Ofir Sharoni, Carl Zeiss SMT
3:35 PM~4:10 PM
J2-4 Miniaturized CMOS Imaging Device for Implantable

Kiyotaka Sasagawa, Nara Institute of Science and Technology
4:10 PM~4:45 PM
J2-5 Breath Analysis for Early Detection and Rapid Diagnosis of Diseases for Preventive Medicine

Kea-Tiong Tang, National Tsing Hua University
4:45 PM~5:20 PM
J2-6 Wearables to Electronics: The Key Enabler for Personalized Healthcare

Jerald Yoo, National University of Singapore

1:40 PM~2:15 PM
J5-1 Scaling of Split-Gate Flash Memory for Embedded Controllers and Machine Learning Applications

Nhan Do, Microchip Technology Inc.
2:15 PM~2:50 PM
J5-2 Embedded Memory: Present status, and memory technology and architecture options for memory-centric computing

Yih Wang, TSMC
2:50 PM~3:25 PM
J5-3 TaOx ReRAM as a highly-reliable embedded memory and its application to edge AI

Ryutaro Yasuhara, Panasonic Semiconductor Solutions Co., Ltd.
3:45 PM~4:20 PM
J5-4 Design and Technology Considerations for Energy-Efficient Embedded Memories

Eric Karl, Intel
4:20 PM~4:55 PM
J5-5 Compute-in-Memory for AI: From Inference to Training

Shimeng Yu, Georgia Institute of Technology
4:55 PM~5:30 PM
J5-6 A Cost-Effective Embedded Nonvolatile Memory with Scalable LEE Flash^®-G2 SONOS for Secure IoT and Computing-in-Memory (CiM) Applications

Koji Nii, Floadia Corp.

Top