Tuesday, August 11, 1:30 PM~5:20 PM Ballroom B
J2 Heterogeneous Integration: Technologies and Applications

  • the photo of Speaker
    1:30 PM~2:05 PM
    J2-1 Advanced 3D Wafer Level System Integration Technology
    Kuo-Chung Yee, TSMC
    余國寵
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    2:05 PM~2:40 PM
    J2-2 3D Heterogeneous Integration Technology for AI System
    Mitsumasa Koyanagi, Tohoku University and T-MicroTec. Co., Ltd.
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    2:40 PM~3:15 PM
    J2-3 Excursion Prevention Strategy to increase Chip Performance by Photomask Tuning
    Ofir Sharoni, Carl Zeiss SMT
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    3:35 PM~4:10 PM
    J2-4 Miniaturized CMOS Imaging Device for Implantable
    Kiyotaka Sasagawa, Nara Institute of Science and Technology
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    4:10 PM~4:45 PM
    J2-5 Wearables to Electronics: The Key Enabler for Personalized Healthcare
    Jerald Yoo, National University of Singapore
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    4:45 PM~5:20 PM
    J2-6 Breath Analysis for Early Detection and Rapid Diagnosis of Diseases for Preventive Medicine
    Kea-Tiong Tang, National Tsing Hua University
    鄭桂忠

Wednesday, August 12, 1:40 PM~4:55 PM Ballroom B
J5 Embedded Memory and Memory-Centric Computing

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    1:40 PM~2:15 PM
    J5-1 Scaling of Split-Gate Flash Memory for Embedded Controllers and Machine Learning Applications
    Nhan Do, Microchip Technology Inc.
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    2:15 PM~2:50 PM
    J5-2 Memory for Data-Centric Computing: A Technology Perspective
    Yih Wang, TSMC
    王奕
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    2:50 PM~3:25 PM
    J5-3 TaOx ReRAM as a highly-reliable embedded memory and its application to edge AI
    Ryutaro Yasuhara, Panasonic Semiconductor Solutions Co., Ltd.
  • the photo of Speaker
    3:45 PM~4:20 PM
    J5-4 Compute-in-Memory for AI: From Inference to Training
    Shimeng Yu, Georgia Institute of Technology
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    4:20 PM~4:55 PM
    J5-5 A Cost-Effective Embedded Nonvolatile Memory with Scalable LEE Flash®-G2 SONOS for Secure IoT and Computing-in-Memory (CiM) Applications
    Koji Nii, Floadia Corp.

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