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Tuesday, April 23, 1:30 PM~3:50 PM Ballroom A
T1
:
Silicon Photonics
1:30 PM~2:05 PM
T1-1
Advances in Quantum Dot Lasers for Silicon Photonics
Yasuhiko Arakawa
The University of Tokyo, Japan
2:05 PM~2:40 PM
T1-2
Silicon Photonics and Integrated Photonic Switches
Ming C. Wu
University of California, Berkeley, USA
2:40 PM~3:15 PM
T1-3
Silicon Photonic Based High-speed Transceivers for Fiber-optic Short-reach Applications
ir. Peter Ossieur
Ghent University - imec IDLab, Belgium
3:15 PM~3:50 PM
T1-4
Layout Automation for Integrated Photonics
Alan Sherman
Mentor, a Siemens Business
Tuesday, April 23, 1:30 PM~5:20 PM Mezzanine A+B
T4
:
Low Dimensional Devices and Materials
1:30 PM~2:00 PM
T4-1
SWCNT and SWCNT-based Heterostructures for Devices
Rong Xiang
The University of Tokyo, Japan
2:00 PM~2:30 PM
T4-2
Toward High-mobility and Low-power 2D MoS
2
Field-effect Transistors
Xinran Wang
Nanjing University, China
2:30 PM~3:00 PM
T4-3
Two-dimensional Materials Electron Devices: Contact and Doping
Yang Chai
The Hong Kong Polytechnic University, Hong Kong
3:20 PM~3:50 PM
T4-4
Synthesis and Electronic Devices of Atom-thin Transition Metal Dichalcogenides
Zheng Liu
Nanyang Technological University, Singapore
3:50 PM~4:20 PM
T4-5
Interface Engineering for 2D Layered Semiconductors
Kosuke Nagashio
The University of Tokyo, Japan
4:20 PM~4:50 PM
T4-6
2D Layered Semiconductors beyond MoS
2
Wen-Hao Chang
National Chiao Tung University, Taiwan
4:50 PM~5:20 PM
T4-7
Electronic Devices within Single Atomic Layer – Development of 2D Lateral Junctions
Jr-Hau He
King Abdullah University of Science & Technology, Saudi Arabia
Wednesday, April 24, 3:50 PM~6:10 PM Ballroom A
T9
:
3D/Heterogeneous Integration and Unconventional Manufacturing
3:50 PM~4:25 PM
T9-1
3D Integration
Piyush Gupta
Qualcomm, USA
4:25 PM~5:00 PM
T9-2
Advanced Stacking Technologies for Heterogeneous Device Integration
Ionut RADU
SOITEC, France
5:00 PM~5:35 PM
T9-3
High Density W2W and D2W DBI® Hybrid Bonding for Stacked Applications
Sitaram Arkalgud
XPERI
5:35 PM~6:10 PM
T9-4
Silicon Photonics as a Post Moore Technology
Koji Yamada
AIST, Japan
Thursday, April 25, 10:20 AM~12:40 PM Ballroom A
T10
:
Machine Learning for the Semiconductor Industry
10:20 AM~10:55 AM
T10-1
VLSI Researches for Machine Learning and Neuromorphic Computing
Atsuya Okazaki
IBM Research - Tokyo, Japan
10:55 AM~11:30 AM
T10-2
Machine Learning and Data Analytics in Semiconductor Manufacturing Equipment
Murali Narasimhan
Applied Materials, USA
11:30 AM~12:05 PM
T10-3
Machine Learning Solutions for Process Control in Semiconductor Manufacturing
Eugen Foca
Carl Zeiss SMT, PCS Group, Germany
12:05 PM~12:40 PM
T10-4
Deploying New Nodes Faster with Machine Learning for IC Design and Manufacturing
Chris Schuermyer
Synopsys, USA
PAGE CONTENTS
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T1 :
Silicon Photonics
-
T4 :
Low Dimensional Devices and Materials
-
T9 :
3D/Heterogeneous Integration and Unconventional Manufacturing
-
T10 :
Machine Learning for the Semiconductor Industry
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