Tuesday, April 23, 1:30 PM~3:50 PM Ballroom A

T1 ： Silicon Photonics

• 
  1:30 PM~2:05 PM

  T1-1 Advances in Quantum Dot Lasers for Silicon Photonics
  

  Yasuhiko Arakawa

  The University of Tokyo, Japan 

• 
  2:05 PM~2:40 PM

  T1-2 Silicon Photonics and Integrated Photonic Switches
  

  Ming C. Wu

  University of California, Berkeley, USA

• 
  2:40 PM~3:15 PM

  T1-3 Silicon Photonic Based High-speed Transceivers for Fiber-optic Short-reach Applications
  

  ir. Peter Ossieur

  Ghent University - imec IDLab, Belgium

• 
  3:15 PM~3:50 PM

  T1-4 Layout Automation for Integrated Photonics
  

  Alan Sherman

  Mentor, a Siemens Business

---

Tuesday, April 23, 1:30 PM~5:20 PM Mezzanine A+B

T4 ： Low Dimensional Devices and Materials

• 
  1:30 PM~2:00 PM

  T4-1 SWCNT and SWCNT-based Heterostructures for Devices
  

  Rong Xiang

  The University of Tokyo, Japan

• 
  2:00 PM~2:30 PM

  T4-2 Toward High-mobility and Low-power 2D MoS₂ Field-effect Transistors
  

  Xinran Wang

  Nanjing University, China

• 
  2:30 PM~3:00 PM

  T4-3 Two-dimensional Materials Electron Devices: Contact and Doping
  

  Yang Chai

  The Hong Kong Polytechnic University, Hong Kong

• 
  3:20 PM~3:50 PM

  T4-4 Synthesis and Electronic Devices of Atom-thin Transition Metal Dichalcogenides
  

  Zheng Liu

  Nanyang Technological University, Singapore

• 
  3:50 PM~4:20 PM

  T4-5 Interface Engineering for 2D Layered Semiconductors
  

  Kosuke Nagashio

  The University of Tokyo, Japan

• 
  4:20 PM~4:50 PM

  T4-6 2D Layered Semiconductors beyond MoS₂
  

  Wen-Hao Chang

  National Chiao Tung University, Taiwan

• 
  4:50 PM~5:20 PM

  T4-7 Electronic Devices within Single Atomic Layer – Development of 2D Lateral Junctions
  

  Jr-Hau He

  King Abdullah University of Science & Technology, Saudi Arabia

---

Wednesday, April 24, 3:50 PM~6:10 PM Ballroom A

T9 ： 3D/Heterogeneous Integration and Unconventional Manufacturing

• 
  3:50 PM~4:25 PM

  T9-1 3D Integration
  

  Piyush Gupta

  Qualcomm, USA

• 
  4:25 PM~5:00 PM

  T9-2 Advanced Stacking Technologies for Heterogeneous Device Integration
  

  Ionut RADU

  SOITEC, France

• 
  5:00 PM~5:35 PM

  T9-3 High Density W2W and D2W DBI® Hybrid Bonding for Stacked Applications
  

  Sitaram Arkalgud

  XPERI

• 
  5:35 PM~6:10 PM

  T9-4 Silicon Photonics as a Post Moore Technology
  

  Koji Yamada

  AIST, Japan

---

Thursday, April 25, 10:20 AM~12:40 PM Ballroom A

T10 ： Machine Learning for the Semiconductor Industry

• 
  10:20 AM~10:55 AM

  T10-1 VLSI Researches for Machine Learning and Neuromorphic Computing
  

  Atsuya Okazaki

  IBM Research - Tokyo, Japan 

• 
  10:55 AM~11:30 AM

  T10-2 Machine Learning and Data Analytics in Semiconductor Manufacturing Equipment
  

  Murali Narasimhan

  Applied Materials, USA 

• 
  11:30 AM~12:05 PM

  T10-3 Machine Learning Solutions for Process Control in Semiconductor Manufacturing
  

  Eugen Foca

  Carl Zeiss SMT, PCS Group, Germany

• 
  12:05 PM~12:40 PM

  T10-4 Deploying New Nodes Faster with Machine Learning for IC Design and Manufacturing
  

  Chris Schuermyer

  Synopsys, USA

---

PAGE CONTENTS

• -T1 :
   Silicon Photonics
• -T4 :
   Low Dimensional Devices and Materials
• -T9 :
   3D/Heterogeneous Integration and Unconventional Manufacturing
• -T10 :
   Machine Learning for the Semiconductor Industry