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Tuesday, April 23, 1:30 PM~5:20 PM Ballroom B
J3
:
5G: From Systems to Devices
1:30 PM~2:05 PM
J3-1
Semiconductor for 5G
Yujun Li
TSMC, Taiwan
2:05 PM~2:40 PM
J3-2
Silicon Technologies for Next Generation 5G Architectures and Applications
Shankaran Janardhanan
GlobalFoundries, USA
2:40 PM~3:15 PM
J3-3
Silicon Process Impact on 5G NR mmWave Front End Design and Performance
Chuan-Cheng Cheng
Qualcomm Technologies, Inc., USA
3:35 PM~4:10 PM
J3-4
R&D Activities for 5G Radio Access Technologies using SHF Bands and Co-Creation of New Services using 5G
Yukihiko Okumura
NTT Docomo, Inc., Japan
4:10 PM~4:45 PM
J3-5
R&D Activities for Capacity Enhancement Using 5G Ultra High-Density Distributed Antenna Systems
Takashi Dateki
Fujitsu Limited, Japan
4:45 PM~5:20 PM
J3-6
Development and Evaluation of Low-SHF-Band C-RAN Massive MIMO System for 5G
Yasushi Maruta
NEC Corp., Japan
Wednesday, April 24, 1:30 PM~5:20 PM Ballroom B
J6
:
Future of Memory: From Storage to Computing
1:30 PM~2:05 PM
J6-1
CRISP: Center for Research on Intelligent Storage and Processing-in-memory
Yuan Xie
University of California at Santa Barbara, USA
2:05 PM~2:40 PM
J6-2
A Perspective on NVRAM Technology for Future Computing System
Katsuhiko Hoya
Toshiba Memory Corporation, Japan
2:40 PM~3:15 PM
J6-3
New Memory Technology, Design and Architecture Co-optimization to Enable Future System Needs
Arnaud Furnémont
Imec, Belgium
3:35 PM~4:10 PM
J6-4
Embedded Memories for Silicon-In-Package: Optimization of Memory Subsystem from AI to Machine Learning
Fatih Hamzaoglu
Intel, USA
4:10 PM~4:45 PM
J6-5
Evolution and Advances of the Nonvolatile Memories and Applications
Yan Li
Western Digital, USA
4:45 PM~5:20 PM
J6-6
Embedded Memory: The Future of Emerging Mmemories
Feng-Min Lee
Macronix, Taiwan
PAGE CONTENTS
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J3 :
5G: From Systems to Devices
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J6 :
Future of Memory: From Storage to Computing
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