1:30 PM~2:05 PM
J3-1 Semiconductor for 5G

Yujun Li
TSMC, Taiwan
2:05 PM~2:40 PM
J3-2 Silicon Technologies for Next Generation 5G Architectures and Applications

Shankaran Janardhanan
GlobalFoundries, USA
2:40 PM~3:15 PM
J3-3 Silicon Process Impact on 5G NR mmWave Front End Design and Performance

Chuan-Cheng Cheng
Qualcomm Technologies, Inc., USA
3:35 PM~4:10 PM
J3-4 R&D Activities for 5G Radio Access Technologies using SHF Bands and Co-Creation of New Services using 5G

Yukihiko Okumura
NTT Docomo, Inc., Japan
4:10 PM~4:45 PM
J3-5 R&D Activities for Capacity Enhancement Using 5G Ultra High-Density Distributed Antenna Systems

Takashi Dateki
Fujitsu Limited, Japan
4:45 PM~5:20 PM
J3-6 Development and Evaluation of Low-SHF-Band C-RAN Massive MIMO System for 5G

Yasushi Maruta
NEC Corp., Japan

1:30 PM~2:05 PM
J6-1 CRISP: Center for Research on Intelligent Storage and Processing-in-memory

Yuan Xie
University of California at Santa Barbara, USA
2:05 PM~2:40 PM
J6-2 A Perspective on NVRAM Technology for Future Computing System

Katsuhiko Hoya
Toshiba Memory Corporation, Japan
2:40 PM~3:15 PM
J6-3 New Memory Technology, Design and Architecture Co-optimization to Enable Future System Needs

Arnaud Furnémont
Imec, Belgium
3:35 PM~4:10 PM
J6-4 Embedded Memories for Silicon-In-Package: Optimization of Memory Subsystem from AI to Machine Learning

Fatih Hamzaoglu
Intel, USA
4:10 PM~4:45 PM
J6-5 Evolution and Advances of the Nonvolatile Memories and Applications

Yan Li
Western Digital, USA
4:45 PM~5:20 PM
J6-6 Embedded Memory: The Future of Emerging Mmemories

Feng-Min Lee
Macronix, Taiwan