Tuesday, April 23, 1:30 PM~5:20 PM Ballroom B
J3 5G: From Systems to Devices

  • the photo of Speaker
    1:30 PM~2:05 PM
    J3-1 Semiconductor for 5G
    Yujun Li
    TSMC, Taiwan
  • the photo of Speaker
    2:05 PM~2:40 PM
    J3-2 Silicon Technologies for Next Generation 5G Architectures and Applications
    Shankaran Janardhanan
    GlobalFoundries, USA
  • the photo of Speaker
    2:40 PM~3:15 PM
    J3-3 Silicon Process Impact on 5G NR mmWave Front End Design and Performance
    Chuan-Cheng Cheng
    Qualcomm Technologies, Inc., USA
  • the photo of Speaker
    3:35 PM~4:10 PM
    J3-4 R&D Activities for 5G Radio Access Technologies using SHF Bands and Co-Creation of New Services using 5G
    Yukihiko Okumura
    NTT Docomo, Inc., Japan
  • the photo of Speaker
    4:10 PM~4:45 PM
    J3-5 R&D Activities for Capacity Enhancement using 5G Ultra High-Density Distributed Antenna Systems
    Takashi Dateki
    Fujitsu Limited, Japan
  • the photo of Speaker
    4:45 PM~5:20 PM
    J3-6 Development and Evaluation of Low-SHF-Band C-RAN Massive MIMO System for 5G
    Yasushi Maruta
    NEC Corp., Japan

Wednesday, April 24, 1:30 PM~5:20 PM Ballroom B
J6 Future of Memory: From Storage to Computing

  • the photo of Speaker
    1:30 PM~2:05 PM
    J6-1 CRISP: Center for Research on Intelligent Storage and Processing-in-memory
    Yuan Xie
    University of California at Santa Barbara, USA 
  • the photo of Speaker
    2:05 PM~2:40 PM
    J6-2 A Perspective on NVRAM Technology for Future Computing System
    Katsuhiko Hoya
    Toshiba Memory Corporation, Japan
  • the photo of Speaker
    2:40 PM~3:15 PM
    J6-3 New Memory Technology, Design and Architecture Co-optimization to Enable Future System Needs
    Arnaud Furnémont
    Imec, Belgium
  • the photo of Speaker
    3:35 PM~4:10 PM
    J6-4 Embedded Memories for Silicon-In-Package: Optimization of Memory Subsystem from AI to Machine Learning
    Fatih Hamzaoglu
    Intel, USA
  • the photo of Speaker
    4:10 PM~4:45 PM
    J6-5 Evolution and Advances of the Nonvolatile Memories and Applications
    Yan Li
    Western Digital, USA
  • the photo of Speaker
    4:45 PM~5:20 PM
    J6-6 Embedded Memory: The Future of Emerging Mmemories
    Feng-Min Lee
    Macronix, Taiwan

Top