Scope of Papers

   The scope of papers requested in 2019 VLSI-TSA includes the following fields : 

  •  Low power CMOS and embedded memory

  •  Foundry technology
  •  RF & THz process, device and integration technology 
  •  Standalone memory: DRAM, FLASH, emerging memory technology
  •  Advanced process modules: e.g. gate stack, junction, strain/channel engineering, low-R 
     contact, low-C spacer/ILD,        
     interconnect technology, ALE and selective deposition, etc.
  •  Nanopatterning: Multiple patterning, Directed Self-Assembly, EUV, etc.
  •  Power and analog IC device and technology  
  •  Advanced CMOS process and devices: Ge, SiGe, III-V, FinFET, GAA, 2D materials/1D

  •  Material, process and device modeling
  •  TFT and organic electronics
  •  MEMS, imagers and sensors
  •  Advanced manufacturing technology, metrology and yield
  •  Reliability physics, characterization and test
  •  Advanced packaging and 2.5D/3D Integration
  •  Photonics and Beyond CMOS Technology
  •  Energy harvesting technology
  •  Wearable and loE enabling technologies
  •  Neuromorphic devices and materials for brain-inspired computing 
  •  Quantum phenomena and information technologies
  •  Device technologies for deep learning applications