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Wednesday, October 23, 10:20 AM~12:20 PM Room:505a+b+c
JP1
:
Joint Plenary Sessions 1
10:20 AM~11:00 AM
JP1-1
The Past, Present, and Future of OLED Displays
Ching W. Tang
Professor
Hong Kong University of Science and Technology, Hong Kong
11:00 AM~11:40 AM
JP1-2
Electronics Manufacturing Challenges and Opportunities: Closing the Gaps via Collaborative Innovation
Marc Benowitz
CEO
iNEMI, USA
11:40 AM~12:20 PM
JP1-3
The Dramatic Past, Present, and Future of Flexible Electrophoretic Display Technology
Michael D. McCreary
Chief Innovation Officer
E Ink Corporation, USA
Thursday, October 24, 9:00 AM~9:40 AM Room:505 a+b+c
JP2
:
Joint Plenary Sessions 2
9:00 AM~9:40 AM
JP2-1
3D Chip Stacking Technologies for the Future
Teruo Hirayama
Executive Chief Engineer
Sony Corporation, Japan
Friday, October 25, 8:50 AM~10:10 AM Room:505a+b+c
JP3
:
Joint Plenary Sessions 3
8:50 AM~10:10 AM
JP3-1
Co-Design of Advanced Packaging and Process Technology for 5G Evolution
Yujun Li
Director
Taiwan Semiconductor Manufacturing Company, Limited, Taiwan
9:30 AM~10:10 AM
JP3-2
New Package Developments for 5G: From Infrastructure to Mobile
Jan Vardaman
President
TechSearch International, Inc., USA
PAGE CONTENTS
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JP1 :
Joint Plenary Sessions 1
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JP2 :
Joint Plenary Sessions 2
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JP3 :
Joint Plenary Sessions 3
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