Monday, April 16, 1:30 PM~4:50 PM Ballroom A

TSA Short Course A ： Advanced Integration Technology

• 
  A-1 3D Monolithic Integration : Advanced CMOS to More-than-Moore Applications
  

  Dr. Veeresh Deshpande

  IMEC, Belgium 

• 
  A-2 Overview and Perspective of Embedded NVM Technology
  

  Mr. Yasuhiko Taito

  Renesas Electronics Corporation, Japan

Monday, April 16, 1:30 PM~4:50 PM Ballroom B

TSA Short Course B ： New Materials for Advanced CMOS and Memory Devices

• 
  B-1 High mobility Ge and III-V Materials for CMOS
  

  Dr. Nadine Collaert

  IMEC, Belgium 

• 
  B-2 High Mobility 2D Materials and Devices: From Phosphorene to Tellurene
  

  Prof. Peide Ye

  Purdue University, USA 

• 
  B-3 HfO2-based new ferroelectric materials
  

  Johannes Ocker 

  Ferroelectric Memory GmbH, Germany 

PAGE CONTENTS

• -TSA Short Course A :
   Advanced Integration Technology
• -TSA Short Course B :
   New Materials for Advanced CMOS and Memory Devices