TSA Short Course A Advanced Integration Technology

1:30 PM~4:50 PM,Monday , April 16 Ballroom A
  • the photo of Speaker
    A-1 3D Monolithic Integration : Advanced CMOS to More-than-Moore Applications
    Monday , April 16
    Dr. Veeresh Deshpande
    IMEC, Belgium 
  • the photo of Speaker
    A-2 Overview and Perspective of Embedded NVM Technology
    Monday , April 16
    Mr. Yasuhiko Taito
    Renesas Electronics Corporation, Japan

TSA Short Course B New Materials for Advanced CMOS and Memory Devices

1:30 PM~4:50 PM,Monday , April 16 Ballroom B
  • the photo of Speaker
    B-1 High mobility Ge and III-V Materials for CMOS
    Monday , April 16
    Dr. Nadine Collaert
    IMEC, Belgium 
  • the photo of Speaker
    B-2 High Mobility 2D Materials and Devices: From Phosphorene to Tellurene
    Monday , April 16
    Prof. Peide Ye
    Purdue University, USA 
  • the photo of Speaker
    B-3 HfO2-based new ferroelectric materials
    Monday , April 16
    Johannes Ocker 
    Ferroelectric Memory GmbH, Germany 

Top