T1 ： Poster Session

11:50 AM~12:20 PM,Tuesday , April 25 Ballroom D

T1-1 Analytical Solution for RESURF and Breakdown Characteristics of Finger STI DEMOS Transistors

Tuesday , April 25

H.C. Tsai*, R.H. Liou, and C.H. Lien*
Taiwan Semiconductor Manufacturing Company, Taiwan
*National Tsing Hua University, Taiwan
T1-2 Impacts of Work Function Variation and Line Edge Roughness on Hybrid TFET-MOSFET Monolithic 3D SRAMs

Tuesday , April 25

Jian-Hao Wang, Pin Su, and Ching-Te Chuang
National Chiao Tung University, Taiwan
T1-3 Evaluation of Analog Performance of Monolayer and Bilayer Two-Dimensional Transition Metal Dichalcogenide (TMD) MOSFETs

Tuesday , April 25

Hung-Yi Lee, Chang-Hung Yu, Pin Su, and Ching-Te Chuang
National Chiao Tung University, Taiwan
T1-4 Performance Evaluation of Pass-Transistor-Based Circuits using Monolayer and Bilayer 2-D Transition Metal Dichalcogenide (TMD) MOSFETs for 5.9nm Node

Tuesday , April 25

Chang-Hung Yu, Jun-Teng Zheng, Pin Su, and Ching-Te Chuang
National Chiao Tung University, Taiwan
T1-5 Twin Gate Tunnel FET based Capacitorless Dynamic Memory

Tuesday , April 25

Nupur Navlakha, Jyi-Tsong Lin*, and Abhinav Kranti
Indian Institute of Technology Indore, India
*National Sun Yat-Sen University, Taiwan
T1-6 Ge n-channel FinFET Performance Enhancement Using Low Work Function Metal-Interfacial Layer-Ge Contacts

Tuesday , April 25

Prashanth P. Manik, Sachin Dev, Nayana Remesh, Yaksh Rawal, Siddhant Khopkar, and Saurabh Lodha
Indian Institute of technology Bombay, India
T1-7 Investigation and Comparison of Design Space for Ultra-Thin-Body GeOI/SOI Negative Capacitance FETs

Tuesday , April 25

Ho-Pei Lee, Chien-Lin Yu, Wei-Xiang You, and Pin Su
National Chiao Tung University, Taiwan
T1-8 Temperature Compensated Super-High-Frequency (2-8 GHz) Surface Acoustic Wave Devices

Tuesday , April 25

Salahuddin Raju, Changjian Zhou*, Bin Li*, and Mansun Chan
Hong Kong University of Science and Technology, Hong Kong
*South China University of Technology, China
T1-9 Impact of Substrate on the Frequency Behavior of Trans-conductance in Ultra-thin Body and BOX FDSOI MOS Devices – A Physical Insight

Tuesday , April 25

Mandar Bhoir, Pragya Kushwaha*, Yogesh S. Chauhan**, and Nihar R. Mohapatra
Indian Institute of Technology Gandhinagar, India
*University of California, Berkeley, USA
**Indian Institute of Technology Kanpur, India
T1-10 TCAD-Based Characterization of Logic Cells: Power, Performance, Area, and Variability

Tuesday , April 25

HW. Karner, C. Kernstock, Z. Stanojevic, O. Baumgartner, F. Schanovsky, *D. Helms, *R. Eilers, *M. Metzdorf, and M. Karner
Global TCAD Solutions, Austria
*OFFIS, Germany
T1-11 Scaling of Gate Dielectric on Ge Substrate (Late News Paper)

Tuesday , April 25

Yung-Hsiang Chan and Bing-Yue Tsui
National Chiao Tung University, Taiwan

T4 ： RRAM

10:20 AM~11:40 AM,Wednesday , April 26 Ballroom A

T4-1 Filament Control of Field-Enhanced WOx Resistive Memory Toward Low Power Applications

Wednesday , April 26

Chao-Hung Wang, Kuang-Hao Chiang, Yu-Hsuan Lin, Jau-Yi Wu, Yung-Han Ho, Erh-Kun Lai, Dai-Ying Lee, Ming-Hsiu Lee, Kuang-Yeu Hsieh, and Chih-Yuan Lu
Macronix International Co., Ltd., Taiwan
T4-2 Occurrence and Solution to Overcome 1st RESET Resistance Pinning Effect in Ti/HfOx based RRAM for Low Power Nonvolatile Memory Applications

Wednesday , April 26

Sk. Ziaur Rahaman, Heng-Yuan Lee, Yu-De Lin, Chien-Hua Hsu, Kan-Hsueh Tsai, Wei-Su Chen, Yu-Sheng Chen, Pang-Shiu Chen*, and Pei-Hua Wang
Industrial Technology Research Institute, Taiwan
*MingShin University of Science and Technology, Taiwan
T4-3 A High Accuracy and Robust Machine Learning Network for Pattern Recognition Based on Binary RRAM devices

Wednesday , April 26

Chen Liu, Runze Han, Sheng Zhang, Maochuan Li, Zheng Zhou, Peng Huang, Lifeng Liu, Xiaoyan Liu, and Jinfeng Kang
Peking University, China
T4-4 Design and Optimization of Strong Physical Unclonable Function (PUF) Based on RRAM Array

Wednesday , April 26

Yachuan Pang, Huaqiang Wu, Bin Gao, Rui Liu*, Shan Wang, Shimeng Yu*, An Chen**, and He Qian
Tsinghua University, China
*Arizona State University, USA
**Semiconductor Research Corporation, USA

T5 ： Interface and 3D Integration

10:20 AM~11:40 AM,Wednesday , April 26 Ballroom B

T5-1 A Universal Model for Interface-type Threshold Switching Phenomena by Comprehensive Study of Vanadium Oxide-Based Selector

Wednesday , April 26

Chih-Yang Lin, Ying-Chen Chen*, Meiqi Guo*,****, Chih-Hung Pan, Fu-Yuan Jin, Yi-Ting Tseng, Cheng Chih Hsieh*, Xiaohan Wu*, Min-Chen Chen, Yao-Feng Chang**, Fei Zhou***, Burt Fowler*, Kuan-Chang Chang, Tsung-Ming Tsai, Ting-Chang Chang, Yonggang Zhao, Simon M. Sze*****, Sanjay Banerjee*, and Jack C. Lee*
National Sun Yat-Sen University, Taiwan
*The University of Texas at Austin, USA
**Micron Technology Inc., USA
***SanDisk, USA
****Tsinghua University, China
*****National Chiao Tung University, Taiwan
T5-2 On the Physical Modeling of Random Telegraph Noise (RTN) Amplitude in Nanoscale MOSFETs: From Ideal to Statistical Devices

Wednesday , April 26

Zexuan Zhang, Shaofeng Guo, Zhe Zhang, Runsheng Wang, and Ru Huang
Peking University, China
T5-3 A Design Methodology of Efficient On-Chip Wireless Power Transmission

Wednesday , April 26

Salahuddin Raju, Clarissa C. Prawoto, Mansun Chan, and C. Patrick Yue
Hong Kong University of Science and Technology, Hong Kong
T5-4 Development and Electrical Investigation of Through Glass Via and Through Si Via in 3D Integration

Wednesday , April 26

Geng-Ming Chang, Shih-Wei Lee, Ching-Yun Chang, and Kuan-Neng Chen
National Chiao Tung University, Taiwan

T6 ： Novel Device

1:30 PM~3:10 PM,Wednesday , April 26 Ballroom A

T6-1 Contact Engineering and Channel Doping for Robust Carbon Nanotube NFETs

Wednesday , April 26

Jianshi Tang*, Damon B. Farmer*, Sarunya Bangsaruntip*, Kuan-Chang Chiu*,**, Bharat Kumar*, and Shu-Jen Han*
*IBM Thomas J. Watson Research Center, USA
**National Tsing Hua University, Taiwan
T6-2 Asymmetric S/D Contacts with BN Tunneling Barrier on Black Phosphorous FETs

Wednesday , April 26

Lingming Yang, Mengwei Si, Qing Paduano*, Mike Snure*, and Peide Ye
Purdue University, USA
*Air Force Research Laboratory, USA
T6-3 Density Functional Theory Molecular Dynamics Simulations and Experimental Measurements of a-HfO2/a-SiO/SiGe(001) and a-HfO2/a-SiO2/SiGe(001) interfaces

Wednesday , April 26

E. Chagarov, K. Sardashti, I. Kwak, S. Ueda , M. Yakimov*, S. Oktyabrsky*, and A. C. Kummel
University of California San Diego, USA
*SUNY Polytechnic Institute, USA
T6-4 A Steep Slope Phase-FET based on 2D MoS2 and the Electronic Phase Transition in VO2

Wednesday , April 26

Benjamin Grisafe, Nikhil Shukla, Matthew Jerry, and Suman Datta
University of Notre Dame, USA
T6-5 Ion Implantation after Germanidation technique for Low Thermal Budget Ge CMOS devices: from Bulk Ge to UTB-GeOI substrate

Wednesday , April 26

Wen Hsin Chang, Toshifumi Irisawa, Hiroyuki Ishii, Hiroyuki Hattori, Hiroyuki Ota, Noriyuki Uchida, and Tatsuro Maeda
National Institute of Advanced Industrial Science and Technology, Japan
T6-6 Selective Etching of Silicon in Preference to Germanium and Si0.5Ge0.5 (Late News Paper)

Wednesday , April 26

Christopher F. Ahles, Jong Youn Choi, Steven Wolf, and Andrew C. Kummel
University of California San Diego, USA

T7 ： Transistor

3:30 PM~4:50 PM,Wednesday , April 26 Ballroom A

T7-1 I/O Device Optimization Techniques Tailored for Highly-scaled FinFET Technology

Wednesday , April 26

Ming-Huei Lin, Chung-An Hu, Chia-Cheng Chen, Tien-Shun Chang, Yun-Ju Sun, Hou-Yu Chen, Vincent S. Chang, and Shyh-Horng Yang
Taiwan Semiconductor Manufacturing Company, Taiwan
T7-2 Stressor Design for FinFETs with Air-Gap Spacers

Wednesday , April 26

Darsen D. Lu, Angada B. Sachid*, Yao-Min Huang**, Yi-Ju Chen**, Chun-Chi Chen**, Min-Cheng Chen**, and Chenming Hu*
National Cheng Kung University, Taiwan
*University of California, Berkeley, USA
**National Nano Device Laboratories, Taiwan
T7-3 Semiconductor-On-Insulator Lateral Bipolar Transistors for High-Speed Low-Power Applications

Wednesday , April 26

Jeng-Bang Yau, J. Cai, T. H. Ning, and K. K. Chan
IBM Thomas J. Watson Research Center, USA
T7-4 A Novel Design of P-N Staggered Face-tunneling TFET Targeting for Low Power and Appropriate Performance Applications

Wednesday , April 26

E. R. Hsieh, Y. C. Fan*, K. Y. Chang*, C. H. Liu*, C. H. Chien, and Steve S. Chung
National Chiao Tung University, Taiwan
*National Taiwan Normal University, Taiwan
T7-5 Ferroelectricity in HfO2 thin films as a function of Zr doping (Late News Paper)

Wednesday , April 26

Golnaz Karbasian, Ava Tan, Ajay Yadav, Eric Martin Henry Sorensen, Claudy Rayan Serrao, Asif Islam Khan, Korok Chatterjee, Sangwan Kim, Chenming Hu, and Sayeef Salahuddin
University of California, Berkeley, USA
T7-6 Integration of III-V Nanowires for the next RF- and logic technology generation (Invited Talk)

Wednesday , April 26

Lars-Erik Wernersson
Lund University, Sweden

T9 ： Memory

10:20 AM~12:00 PM,Thursday , April 27 Ballroom B

T9-1 Exploration and Evaluation of TCAM with Hybrid Tunneling FET and FinFET Devices for Ultra-Low-Voltage Applications

Thursday , April 27

Meng-Hsuan Tu, Yin-Nien Chen, Pin Su, and Ching-Te Chuang
National Chiao Tung University, Taiwan
T9-2 Dense N over CMOS 6T SRAM Cells using 3D Sequential Integration

Thursday , April 27

C-M. V. Lu*,**, C. Fenouillet-Beranger*, M. Brocard*, O. Billoint*, G. Cibrario*, L. Brunet*, X. Garros*, C. Leroux*, M. Casse*, A. Laurent*, A. Toffoli*, G. Romano*,**, R. Kies*, R. Gassilloud*, N. Rambal*, V. Lapras*, M-P. Samson*,**, C. Tallaron*,**, C. Tabone*, B. Previtali*, D. Barge**, A. Ayres*,**, L. Pasini*,**, P. Besombes*, F. Andrieu*, P. Batude*, T. Skotnicki**, and M. Vinet*
*CEA-Leti, France
**STMicroelectronics, France
T9-3 An Investigation of Program Disturb Characteristics and Data Pattern Effect in 128G 3D NAND Flash Memories

Thursday , April 27

Yu-Hung Yeh, Sheng-Hung Shih, Jen-Chien Fu*, Chrong-Jung Lin, and Ya-Chin King
National Tsing Hua University, Taiwan
*Lite-On Technology Corp., Taiwan
T9-4 Hardware Implementation of Physically Unclonable Function (PUF) in Perpendicular STT MRAM

Thursday , April 27

D. Y. Wang, Y. C. Hsin, K. Y. Lee, G. L. Chen, S. Y. Yang, H. H. Lee, Y. J. Chang, I. J. Wang, Y. C. Kuo, Y. S. Chen, P. H. Wang, C. I. Wu, and D. D. Tang
Industrial Technology Research Institute, Taiwan
T9-5 A Magnetic Shift Register with Periodic Potential Energy Modulation

Thursday , April 27

T. Kondo, H. Morise, T. Shimada, M. Quinsat, M. Kado, Y. Ootera, and S. Nakamura
Toshiba Corporation, Japan

Top

T1 ： Poster Session

H.C. Tsai*, R.H. Liou, and C.H. Lien*Taiwan Semiconductor Manufacturing Company, Taiwan *National Tsing Hua University, Taiwan

Jian-Hao Wang, Pin Su, and Ching-Te ChuangNational Chiao Tung University, Taiwan

Hung-Yi Lee, Chang-Hung Yu, Pin Su, and Ching-Te ChuangNational Chiao Tung University, Taiwan

Chang-Hung Yu, Jun-Teng Zheng, Pin Su, and Ching-Te ChuangNational Chiao Tung University, Taiwan

Nupur Navlakha, Jyi-Tsong Lin*, and Abhinav KrantiIndian Institute of Technology Indore, India*National Sun Yat-Sen University, Taiwan

Prashanth P. Manik, Sachin Dev, Nayana Remesh, Yaksh Rawal, Siddhant Khopkar, and Saurabh LodhaIndian Institute of technology Bombay, India

Ho-Pei Lee, Chien-Lin Yu, Wei-Xiang You, and Pin SuNational Chiao Tung University, Taiwan

Salahuddin Raju, Changjian Zhou*, Bin Li*, and Mansun ChanHong Kong University of Science and Technology, Hong Kong *South China University of Technology, China

Mandar Bhoir, Pragya Kushwaha*, Yogesh S. Chauhan**, and Nihar R. MohapatraIndian Institute of Technology Gandhinagar, India *University of California, Berkeley, USA **Indian Institute of Technology Kanpur, India

HW. Karner, C. Kernstock, Z. Stanojevic, O. Baumgartner, F. Schanovsky, *D. Helms, *R. Eilers, *M. Metzdorf, and M. KarnerGlobal TCAD Solutions, Austria*OFFIS, Germany

Yung-Hsiang Chan and Bing-Yue TsuiNational Chiao Tung University, Taiwan

T4 ： RRAM

Chao-Hung Wang, Kuang-Hao Chiang, Yu-Hsuan Lin, Jau-Yi Wu, Yung-Han Ho, Erh-Kun Lai, Dai-Ying Lee, Ming-Hsiu Lee, Kuang-Yeu Hsieh, and Chih-Yuan LuMacronix International Co., Ltd., Taiwan

Sk. Ziaur Rahaman, Heng-Yuan Lee, Yu-De Lin, Chien-Hua Hsu, Kan-Hsueh Tsai, Wei-Su Chen, Yu-Sheng Chen, Pang-Shiu Chen*, and Pei-Hua WangIndustrial Technology Research Institute, Taiwan *MingShin University of Science and Technology, Taiwan

Chen Liu, Runze Han, Sheng Zhang, Maochuan Li, Zheng Zhou, Peng Huang, Lifeng Liu, Xiaoyan Liu, and Jinfeng KangPeking University, China

Yachuan Pang, Huaqiang Wu, Bin Gao, Rui Liu*, Shan Wang, Shimeng Yu*, An Chen**, and He QianTsinghua University, China*Arizona State University, USA**Semiconductor Research Corporation, USA

T5 ： Interface and 3D Integration

Zexuan Zhang, Shaofeng Guo, Zhe Zhang, Runsheng Wang, and Ru HuangPeking University, China

Salahuddin Raju, Clarissa C. Prawoto, Mansun Chan, and C. Patrick YueHong Kong University of Science and Technology, Hong Kong

Geng-Ming Chang, Shih-Wei Lee, Ching-Yun Chang, and Kuan-Neng ChenNational Chiao Tung University, Taiwan

T6 ： Novel Device

Jianshi Tang*, Damon B. Farmer*, Sarunya Bangsaruntip*, Kuan-Chang Chiu*,**, Bharat Kumar*, and Shu-Jen Han**IBM Thomas J. Watson Research Center, USA **National Tsing Hua University, Taiwan

Lingming Yang, Mengwei Si, Qing Paduano*, Mike Snure*, and Peide YePurdue University, USA *Air Force Research Laboratory, USA

E. Chagarov, K. Sardashti, I. Kwak, S. Ueda , M. Yakimov*, S. Oktyabrsky*, and A. C. Kummel University of California San Diego, USA*SUNY Polytechnic Institute, USA

Benjamin Grisafe, Nikhil Shukla, Matthew Jerry, and Suman DattaUniversity of Notre Dame, USA

Wen Hsin Chang, Toshifumi Irisawa, Hiroyuki Ishii, Hiroyuki Hattori, Hiroyuki Ota, Noriyuki Uchida, and Tatsuro MaedaNational Institute of Advanced Industrial Science and Technology, Japan

Christopher F. Ahles, Jong Youn Choi, Steven Wolf, and Andrew C. KummelUniversity of California San Diego, USA

T7 ： Transistor

Ming-Huei Lin, Chung-An Hu, Chia-Cheng Chen, Tien-Shun Chang, Yun-Ju Sun, Hou-Yu Chen, Vincent S. Chang, and Shyh-Horng YangTaiwan Semiconductor Manufacturing Company, Taiwan

Darsen D. Lu, Angada B. Sachid*, Yao-Min Huang**, Yi-Ju Chen**, Chun-Chi Chen**, Min-Cheng Chen**, and Chenming Hu*National Cheng Kung University, Taiwan *University of California, Berkeley, USA**National Nano Device Laboratories, Taiwan

Jeng-Bang Yau, J. Cai, T. H. Ning, and K. K. ChanIBM Thomas J. Watson Research Center, USA

E. R. Hsieh, Y. C. Fan*, K. Y. Chang*, C. H. Liu*, C. H. Chien, and Steve S. ChungNational Chiao Tung University, Taiwan*National Taiwan Normal University, Taiwan

Golnaz Karbasian, Ava Tan, Ajay Yadav, Eric Martin Henry Sorensen, Claudy Rayan Serrao, Asif Islam Khan, Korok Chatterjee, Sangwan Kim, Chenming Hu, and Sayeef SalahuddinUniversity of California, Berkeley, USA

Lars-Erik Wernersson Lund University, Sweden

T9 ： Memory

Meng-Hsuan Tu, Yin-Nien Chen, Pin Su, and Ching-Te ChuangNational Chiao Tung University, Taiwan

Yu-Hung Yeh, Sheng-Hung Shih, Jen-Chien Fu*, Chrong-Jung Lin, and Ya-Chin KingNational Tsing Hua University, Taiwan*Lite-On Technology Corp., Taiwan

D. Y. Wang, Y. C. Hsin, K. Y. Lee, G. L. Chen, S. Y. Yang, H. H. Lee, Y. J. Chang, I. J. Wang, Y. C. Kuo, Y. S. Chen, P. H. Wang, C. I. Wu, and D. D. TangIndustrial Technology Research Institute, Taiwan

T. Kondo, H. Morise, T. Shimada, M. Quinsat, M. Kado, Y. Ootera, and S. NakamuraToshiba Corporation, Japan

PAGE CONTENTS

H.C. Tsai, R.H. Liou, and C.H. Lien
Taiwan Semiconductor Manufacturing Company, Taiwan
*National Tsing Hua University, Taiwan

Jian-Hao Wang, Pin Su, and Ching-Te Chuang
National Chiao Tung University, Taiwan

Hung-Yi Lee, Chang-Hung Yu, Pin Su, and Ching-Te Chuang
National Chiao Tung University, Taiwan

Chang-Hung Yu, Jun-Teng Zheng, Pin Su, and Ching-Te Chuang
National Chiao Tung University, Taiwan

Nupur Navlakha, Jyi-Tsong Lin, and Abhinav Kranti
Indian Institute of Technology Indore, India
National Sun Yat-Sen University, Taiwan

Prashanth P. Manik, Sachin Dev, Nayana Remesh, Yaksh Rawal, Siddhant Khopkar, and Saurabh Lodha
Indian Institute of technology Bombay, India

Ho-Pei Lee, Chien-Lin Yu, Wei-Xiang You, and Pin Su
National Chiao Tung University, Taiwan

Salahuddin Raju, Changjian Zhou, Bin Li, and Mansun Chan
Hong Kong University of Science and Technology, Hong Kong
*South China University of Technology, China

Mandar Bhoir, Pragya Kushwaha*, Yogesh S. Chauhan**, and Nihar R. Mohapatra
Indian Institute of Technology Gandhinagar, India
*University of California, Berkeley, USA
**Indian Institute of Technology Kanpur, India

HW. Karner, C. Kernstock, Z. Stanojevic, O. Baumgartner, F. Schanovsky, D. Helms, R. Eilers, M. Metzdorf, and M. Karner
Global TCAD Solutions, Austria
OFFIS, Germany

Yung-Hsiang Chan and Bing-Yue Tsui
National Chiao Tung University, Taiwan

Chao-Hung Wang, Kuang-Hao Chiang, Yu-Hsuan Lin, Jau-Yi Wu, Yung-Han Ho, Erh-Kun Lai, Dai-Ying Lee, Ming-Hsiu Lee, Kuang-Yeu Hsieh, and Chih-Yuan Lu
Macronix International Co., Ltd., Taiwan

Sk. Ziaur Rahaman, Heng-Yuan Lee, Yu-De Lin, Chien-Hua Hsu, Kan-Hsueh Tsai, Wei-Su Chen, Yu-Sheng Chen, Pang-Shiu Chen, and Pei-Hua Wang
Industrial Technology Research Institute, Taiwan
MingShin University of Science and Technology, Taiwan

Chen Liu, Runze Han, Sheng Zhang, Maochuan Li, Zheng Zhou, Peng Huang, Lifeng Liu, Xiaoyan Liu, and Jinfeng Kang
Peking University, China

Yachuan Pang, Huaqiang Wu, Bin Gao, Rui Liu, Shan Wang, Shimeng Yu, An Chen**, and He Qian
Tsinghua University, China
*Arizona State University, USA
**Semiconductor Research Corporation, USA

Zexuan Zhang, Shaofeng Guo, Zhe Zhang, Runsheng Wang, and Ru Huang
Peking University, China

Salahuddin Raju, Clarissa C. Prawoto, Mansun Chan, and C. Patrick Yue
Hong Kong University of Science and Technology, Hong Kong

Geng-Ming Chang, Shih-Wei Lee, Ching-Yun Chang, and Kuan-Neng Chen
National Chiao Tung University, Taiwan

Jianshi Tang, Damon B. Farmer, Sarunya Bangsaruntip, Kuan-Chang Chiu,**, Bharat Kumar, and Shu-Jen Han
*IBM Thomas J. Watson Research Center, USA
**National Tsing Hua University, Taiwan

Lingming Yang, Mengwei Si, Qing Paduano, Mike Snure, and Peide Ye
Purdue University, USA
*Air Force Research Laboratory, USA

E. Chagarov, K. Sardashti, I. Kwak, S. Ueda , M. Yakimov, S. Oktyabrsky, and A. C. Kummel
University of California San Diego, USA
*SUNY Polytechnic Institute, USA

Benjamin Grisafe, Nikhil Shukla, Matthew Jerry, and Suman Datta
University of Notre Dame, USA

Wen Hsin Chang, Toshifumi Irisawa, Hiroyuki Ishii, Hiroyuki Hattori, Hiroyuki Ota, Noriyuki Uchida, and Tatsuro Maeda
National Institute of Advanced Industrial Science and Technology, Japan

Christopher F. Ahles, Jong Youn Choi, Steven Wolf, and Andrew C. Kummel
University of California San Diego, USA

Ming-Huei Lin, Chung-An Hu, Chia-Cheng Chen, Tien-Shun Chang, Yun-Ju Sun, Hou-Yu Chen, Vincent S. Chang, and Shyh-Horng Yang
Taiwan Semiconductor Manufacturing Company, Taiwan

Darsen D. Lu, Angada B. Sachid, Yao-Min Huang, Yi-Ju Chen, Chun-Chi Chen, Min-Cheng Chen, and Chenming Hu
National Cheng Kung University, Taiwan
*University of California, Berkeley, USA
**National Nano Device Laboratories, Taiwan

Jeng-Bang Yau, J. Cai, T. H. Ning, and K. K. Chan
IBM Thomas J. Watson Research Center, USA

E. R. Hsieh, Y. C. Fan, K. Y. Chang, C. H. Liu, C. H. Chien, and Steve S. Chung
National Chiao Tung University, Taiwan
National Taiwan Normal University, Taiwan

Golnaz Karbasian, Ava Tan, Ajay Yadav, Eric Martin Henry Sorensen, Claudy Rayan Serrao, Asif Islam Khan, Korok Chatterjee, Sangwan Kim, Chenming Hu, and Sayeef Salahuddin
University of California, Berkeley, USA

Lars-Erik Wernersson
Lund University, Sweden

Meng-Hsuan Tu, Yin-Nien Chen, Pin Su, and Ching-Te Chuang
National Chiao Tung University, Taiwan

Yu-Hung Yeh, Sheng-Hung Shih, Jen-Chien Fu, Chrong-Jung Lin, and Ya-Chin King
National Tsing Hua University, Taiwan
Lite-On Technology Corp., Taiwan

D. Y. Wang, Y. C. Hsin, K. Y. Lee, G. L. Chen, S. Y. Yang, H. H. Lee, Y. J. Chang, I. J. Wang, Y. C. Kuo, Y. S. Chen, P. H. Wang, C. I. Wu, and D. D. Tang
Industrial Technology Research Institute, Taiwan

T. Kondo, H. Morise, T. Shimada, M. Quinsat, M. Kado, Y. Ootera, and S. Nakamura
Toshiba Corporation, Japan