Scope
• Low power CMOS and embedded memory • Foundry technology • RF process, device and integration technology • Standalone memory: DRAM, FLASH, emerging memory technology • Advanced CMOS modules: e.g. gate stack, contact, doping, strained channel, non-Si integration,
interconnect technology, ALE and selective deposition, etc.
• Lithography: directed self-assembly, EUV, multiple patterning, etc. • Power and analog IC device and technology • Advanced CMOS process and devices: Ge, SiGe, III-V, GAA, 2D/1D • Process and device modeling • TFT and organic electronics • MEMS, imagers and sensors • Advanced manufacturing technology, yield, reliability and test • 3D ICs and advanced packaging • Photonics • Energy harvesting technology • loT enabling technologies