Chair :

Seng-Pan (Ben) U

University of Macao, China

Co-chair :

Tsung-Hsien Lin   

National Taiwan University, Taiwan

Mau-Chung Chang

University of California, Los Angeles, USA

Baoyong Chi

Tsinghua University, China

Shen Feng

Montage Corporation, China

Hsieh-Hung Hsieh

TSMC, Taiwan

Po-Chiun Huang

National Tsing Hua University, Taiwan

Chung-Chih Hung

National Chiao Tung University, Taiwan

Jaeha Kim

Seoul National University, Korea

Shohei Kousai

Toshiba, Japan

Yan Li

RFMD, Phoenix Design Center, USA

Ginkou Ma

Industrial Technology Research Institute, Taiwan

Noriyuki Miura

Kobe University, Japan

Kenichi Okada

Tokyo Institute of Technology, Japan

Woogeun Rhee

Tsinghua University, China

Yang Xu

Illinois Institute of Technology, USA

Feng Zhao

Apple Inc., USA