Monday, April 25, 1:30 PM~3:25 PM Ballroom B

  • the photo of Speaker
    T2-1 ReRAM-based Analog Synapse and IMT Neuron Device for Neuromorphic System (Invited Talk)
  • T2-2 Oxygen chemical potential profile optimization for fast low current (<10µA) resistive switching in Oxide-based RRAM
  • T2-3 Excellent Resistance Variability Control of WOx ReRAM by a Smart Writing Algorithm
  • T2-4 Transient Control of Resistive Random Access Memory for High Speed and High Endurance Performance
  • T2-5 A Compact Model for the SET Parameter Variations of oxide RRAM Array

Monday, April 25, 3:50 PM~5:05 PM Ballroom B
T4 Novel Device I

  • the photo of Speaker
    T4-1 Self Assembled Ordered Phthalocyanine Monolayers on 2D Semiconductors for Subnanometer dielectric ALD Nucleation (Invited Talk)
  • the photo of Speaker
    T4-2 Advanced Metrology and Inspection Solutions for a 3D World (Invited Talk)
  • T4-3 P-type Surface Charge Transfer Doping of Black Phosphorus Field-effect Transistors
  • T4-4 Performance Benchmarking of Monolayer and Bilayer Two-Dimensional Transition Metal Dichalcogenide (TMD) Based Logic Circuits
  • T4-5 Record high current density and low contact resistance in MoS2 FETs by ion doping

Tuesday, April 26, 10:20 AM~12:00 PM Ballroom B

  • T5-1 SRAM cell performance analysis beyond 10-nm FinFET technology
  • T5-2 Deep Understanding of Random Telegraph Noise (RTN) Effects on SRAM Stability
  • T5-3 Investigation of Local Heating Effect for 14nm Ge pFinFETs based on Monte Carlo Method
  • T5-4 Corner Spacer Design for Performance Optimization of Multi-Gate InGaAs-OI FinFET with Gate-to-Source/Drain Underlap
  • T5-5 Simulation of Nano-Scale Double Gate In0.53Ga0.47As nMOSFETs by a Deterministic BTE Solver
  • T5-6 Optimization of Fin Profile and Implant in Bulk FinFET Technology (Late News Paper)

Tuesday, April 26, 10:20 AM~12:15 PM Ballroom C
T7 3D IC I

  • the photo of Speaker
    T7-1 Key Enablers for 3D Sequential Integration (Invited Talk)
  • T7-2 Implementation of Memory Stacking on Logic Controller by Using 3DIC 300mm Backside TSV Process Integration
  • T7-3 Impact of Transistor Technology on Power Savings in Monolithic 3D ICs
  • T7-4 A-SiGeC Thin Film Photovoltaic Enabled Self-Power Monolithic 3D IC Under Indoor Illumination
  • T7-5 Reliable High-Voltage Amorphous InGaZnO TFT for Monolithic 3D Integration

Tuesday, April 26, 1:30 PM~3:10 PM Ballroom B
T8 Processing Technologies

  • T8-6 PMOS Contact Resistance Solution Compatible to CMOS Integration for 7 nm Node And Beyond (Late News Paper)
  • T8-1 Low Contact Resistivity (1.5×10-8 Ω-cm2) of Phosphorus-doped Ge by In-situ Chemical Vapor Deposition Doping and Laser Annealing
  • T8-2 Low Temperature Microwave Annealed FinFETs with Less Vth Variability
  • T8-3 In0.53Ga0.47As(001)-(2x4) and Si0.5Ge0.5(110) surface passivation by self-limiting deposition of silicon containing control layers
  • T8-4 Electrical Defect Spectroscopy and Reliability Prediction Through a Novel Simulation-Based Methodology
  • T8-5 RF Performance of Passive Components on State-of-Art Trap Rich Silicon- on-Insulator Substrates

Tuesday, April 26, 1:30 PM~3:10 PM Ballroom C
T9 Novel Device II

  • the photo of Speaker
    T9-1 The Opportunity for bulk GaN Power Device - Technology and Application (Invited Talk)
  • T9-2 Short-Channel BEOL ZnON Thin-Film Transistors with Superior Mobility Performance
  • T9-3 High-gain, Low-voltage BEOL Logic Gate Inverter Built with Film Profile Engineered IGZO Transistors
  • T9-4 Nickel-Phosphide Contact for Effective Schottky Barrier Modulation in Black Phosphorus P-Channel Transistors
  • T9-5 Experimental Demonstration of Performance Improvement with a Strain Boost Technique Tailored for 3-Dimensional Structure on Nano-Scaled Bulk pFinFETs
  • T9-6 Fine charge sensing using a Silicon Nanowire for Biodetection

Tuesday, April 26, 3:30 PM~4:30 PM Ballroom B

  • T10-1 A TiO2-based Volatile Threshold Switching Selector Device with 10^7 non linearity and sub 100pA off current
  • T10-2 Variable-length Gateless Transistor for Analog One-Time-Programmable Memory Applications
  • T10-3 An Innovative 1T1R Dipole Dynamic Random Access Memory (DiRAM) featuring High Speed, Ultra-low power, and Low Voltage Operation

Tuesday, April 26, 3:30 PM~4:30 PM Ballroom C
T11 3D IC II

  • T11-1 Wafer-Level MOSFET with Submicron Photolysis Polymer Temporary Bonding Technology Using Ultra-Fast Laser Ablation for 3DIC Application
  • T11-2 Compact Modeling and Simulation of TSV with Experimental Verification
  • T11-3 Electrical Testing Structure for Stacking Error Measurement in 3D Integration

Wednesday, April 27, 10:20 AM~12:15 PM Ballroom C

  • the photo of Speaker
    T13-1 Doping Technology for RRAM - Opportunities and Challenges (Invited Talk)
  • T13-2 Effect of Ti Buffer Layer on HfOx-Based Bipolar and Complementary Resistive Switching for Future Memory Applications
  • T13-3 Low power/self-compliance of resistive switching elements modified with a conduction Ta-oxide layer through low temperature plasma oxidization of Ta thin film
  • T13-4 Comprehensive Study of Intrinsic Unipolar SiOx-Based ReRAM Characteristics in AC Frequency Response and Low Voltage (< 2V) Operation
  • T13-5 A New Manufacturing Method of CMOS Logic Compatible 1T-CRRAM