North America Subcommittee

Chair:

Gary Chen, TSMC

Members:

• Jason Campbell, NIST

• Robert D. Clark, TEL Technology Center, America, LLC

• Saptarshi Das, Penn State University

• Patrick Fay, University of Notre Dame

• Andrew C. Kummel, University of California, San Diego

• Prashant Majhi, Intel

• Andrew Mannix, Stanford University

• Wilman Tsai, Stanford University

• Hui Jae Yoo, Intel

• Naomi Yoshida, Applied Materials