Asia Pacific Subcommittee

<Taiwan and others>

Chair:

Ya-Chin King, National Tsing Hua University

Members:

• Mansun Chan,The Hong Kong University of Science and Technology

• S. Z. Chang, Powerchip Semiconductor Manufacturing Corporation

• Xiao GONG, National University of Singapore

• Tuo-Hung Hou, National Yang Ming Chiao Tung University

• JianJang Huang, National Taiwan University

• Wen Yueh Jang, Powerchip Semiconductor Manufacture Corporation

• Dae-Hyun Kim, Kyungpook National University

• Dongwon Kim, Samsung Electronics

• Dai-Ying Lee, Macronix International Co., Ltd.

• Chenhsin Lien, National Tsing Hua University

• Chrong Jung Lin, National Tsing Hua University

• Enshao Liu, Taiwan Semiconductor Manufacturing Company, Ltd.

• Nagarajan Raghavan, Singapore University of Technology and Design

• Samit Kumar Ray, IIT KGP

• Jia-Min Shieh,Taiwan Semiconductor Research Institute, NARlabs

• Wenchi Ting, UMC

• Bing-Yue Tsui,National Yang Ming Chiao Tung University

<China>

Chair:

Ru Huang, Peking University

Members:

• Ming He, Peking University

• Zhigang Ji, Shanghai Jiao Tong University

• Jin-Feng Kang, Peking University

• Litao Sun, Southeast University

• Kechao Tang, Peking University

• Huaqiang Wu, Tsinghua University (Beijing)

• Yi Zhao, Zhejiang University

• Peng Zhou, Fudan University

<Japan>

Chair:

Kazuhiko Endo, Tohoku University

Members:

• Wen Hsin Chang, Advanced Industrial Science and Technology (AIST)

• Jiro Ida, Kanazawa Institute of Technology

• Masaharu Kobayashi,The University of Tokyo

• Tetsu Ohtou, Tokyo Electron

• Satofumi Souma, Kobe University