J3 Joint Special Session : Design and Technology Co-Optimization

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    J3-1 Analysis of Thermal Effects in Integrated Radio Transmitters
    Christian Fager
    Chalmers University of Technology, Sweden  
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    J3-2 Unified Technology Optimization Platform using Integrated Analysis (UTOPIA) for holistic pathfinding DTCO of advanced transistors
    Stanley Seungchul Song
    Qualcomm, USA
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    J3-3 Systematic Co-Optimization From Chip Design, Process Technology To Systems For GPU AI Chip
    John Hu
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    J3-4 Machine Learning for IC Design and Technology Co-Optimization in Extreme Scaling
    David Z. Pan
    University of Texas at Austin, USA
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    J3-5 Abundant-Data Computing: The N3XT 1,000X
    Subhasish Mitra
    Stanford University, USA 
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    J3-6 Co-designed Systems for Deep Learning Hardware Accelerators
    David M. Brooks
    Harvard University, USA

J6 Joint special session : Technology and Design Challenges for Next Generation Communication

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    J6-1 Antenna-in-Package Design and Module Integration for Millimeter-Wave Communication and 5G
    Xiaoxiong Gu
    IBM, USA
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    J6-2 Emerging Technologies and Concepts for 5G Applications
    Wolfgang Bösch
     Graz University of Technology, Austria
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    J6-3 GaN-based digital transmitter architectures for 5G
    Florian Hühn
    FBH-Berlin, Germany
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    J6-4 5G mmWave communication: from system concept to implementation
    Chih-Yuan Lin
    MediaTek, Taiwan
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    J6-5 Phased array technique for mm-wave wireless communication
    Chien-Nan Kuo
    National Chiao Tung University, Taiwan 
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    J6-6 Massive MIMO Detection VLSI Design
    Chia-Hsiang Yang
     National Taiwan University, Taiwan

D4 DAT Special Session : Machine Learning for EDA

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    D4-1 Digital Intelligence and Chip Design
    Sashi Obilisetty
    Synopsys, USA
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    D4-2 Machine Learning Further Improving Place and Route QoR
    Weibin Ding
    Cadence, China
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    D4-3 Machine Learning Opportunities and Applications in SoC Design
    Bauli Yang
    MediaTek, Taiwan

D8 DAT Special Session : Innovative Approaches on Hardware Security Enhancements

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    D8-1 On IC Traceability via Blockchain
    Sandip Kundu
    University of Massachusetts, USA
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    D8-2 Side-Channel-Aware LSI design
    Naofumi Homma
    Tohoku University, Japan
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    D8-3 A Foundry’s View on Hardware Security
    Shih-Lien Lu
    TSMC, Taiwan 

D10 DAT Special Session : Sensing, Computing, and Connectivity Technology for Autonomous Driving Vehicles

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    D10-1 CMOS Single-Photon Detectors for Vehicle LiDAR – Status and Trends
    Sheng-Di Lin
    National Chiao Tung University, Taiwan  
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    D10-2 Safe and Secure SOC Architecture for Autonomous Driving
    Lei Gao
    NXP Semiconductors, China 
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    D10-3 V2V & V2I for Connected Vehicle
    Darren Chen
    LITE-ON Technology Corp., Taiwan

D12 DAT Special Session : IC Design for Machine Learning

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    D12-1 End-to-End Hardware Accelerator for Deep Convolutional Neural Network
    Tian-Sheuan Chang
    National Chiao Tung University, Taiwan
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    D12-2 Efficient Method for AI Computing
    Simon See
    NVIDIA Corp., Singapore
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    D12-3 A glance of the CASLab HSAIL SIMT GPU for OpenCL and TensorFlow Applications
    Chung-Ho Chen
    National Cheng Kung University, Taiwan 

D13 Industrial Session : System Level Testing and Security

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    D13-1 Beyond Structural Test, the rising need for System-Level Test
    Harry H. Chen
    MediaTek, Taiwan 
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    D13-2 Adaptive Test Method on Production System-Level Testing (SLT) to Optimize Test Cost, Resources and Defect Parts per Million (DPPM)
    Subagaran Letchumanan
    Intel, Malaysia 
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    D13-3 Fuzz Testing & Software Composition Analysis in Software Engineering
    Eugene Yang
    Synopsys, Taiwan

D15 Industrial Session : AI everywhere: where will you be?

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    D15-1 Technology Trend of Edge AI
    Yen-Lin Lee
    Mediatek, Taiwan
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    D15-2 Deep Fusion of Heterogeneous Sensor Modalities for the Advancements of ADAS to Autonomous Vehicles
    Tse-Min Chen
    Industrial Technology Research Institute, Taiwan
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    D15-3 Acceleration of Neural Network Model Execution on Embedded Systems
    May-chen Martin-Kuo
    Deep Force Inc., USA